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TCN2-26+ is listed in the Balun range at ChipApex. The manufacturer field lists Mini-Circuits. Its product description is 1:2 LTCC TRANSFORMER, 1600 - 260. Review the specifications below when checking this part for your BOM.
The TCN2-26+ is an LTCC transformer designed for RF applications, operating within a frequency range of 1.6 GHz to 2.6 GHz. It features a 1:2 impedance transformation ratio and maintains a nominal 50 Ohm impedance across its bandwidth. The component utilizes a surface-mount package with no leads, specifically the FV1206-1 case style. This balun supports a maximum power handling capacity of 2.5 Watts at 100°C, requiring linear derating as temperature increases.
Verify the specific ordering suffix to ensure compliance with RoHS standards and lead-free requirements. Confirm that the requested quantity matches the tape and reel packaging specifications provided by Mini-Circuits. Ensure storage conditions align with moisture sensitivity levels to prevent degradation before assembly. Cross-reference the datasheet version to confirm updated electrical characteristics.
Select this component when a compact solution is required for balancing signals in the 1.6 GHz to 2.6 GHz range. Consider the thermal management requirements due to the 2.5W power limit at elevated temperatures. Evaluate the physical footprint constraints against the FV1206-1 package dimensions. Ensure system impedance matches the 50 Ohm specification for optimal performance.
This part belongs to Mini-Circuits' portfolio of passive RF components, specifically focusing on transformers and baluns. It complements active devices like amplifiers and mixers used in complex assemblies such as upconverters. The product line emphasizes in-house manufacturing quality and supply-chain stability for critical infrastructure applications.
Consult official Mini-Circuits documentation for direct substitutes. Verify compatibility regarding frequency range, impedance ratio, and physical package dimensions. Ensure any alternative component meets the same power handling and thermal derating requirements.
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