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TD-125.000MBD-T is listed in the Oscillators range at ChipApex. The manufacturer field lists TXC CORPORATION. Its product description is MEMS OSC XO 125.0000MHZ CMOS SMD. Review the specifications below when checking this part for your BOM.
The TD-125.000MBD-T is a MEMS oscillator manufactured by TXC Corporation, operating at a frequency of 125 MHz. It utilizes CMOS output logic and functions as a standard XO (Xtal Oscillator). The device supports an enable/disable function for power management control. It operates on a 3.3V supply voltage and is housed in a compact 4-SMD, No Lead surface-mount package. The component is designed for applications requiring precise timing signals with low profile dimensions.
Verify the specific datasheet version for the TD-125.000MBD-T to confirm current RoHS compliance status and lead-free soldering parameters. Ensure that the 3.3V supply requirements align with the target system's power rails. Check for any recent product change notices or obsolescence announcements from TXC Corporation prior to finalizing procurement plans.
Select this component when a 125 MHz CMOS clock source is required in a small form factor. The MEMS construction offers robustness against shock and vibration compared to traditional quartz alternatives. Consider the enable pin requirement if dynamic power saving is necessary. Verify that the 4-SMD package footprint matches the PCB layout constraints.
This part belongs to the TD series of MEMS oscillators from TXC Corporation. It serves as a timing reference solution for modern electronic devices. The series emphasizes miniaturization and reliability. It replaces older crystal oscillator designs in space-constrained applications. The 125 MHz frequency is common in telecommunications and high-performance computing sectors.
Direct replacements may include other 125 MHz CMOS MEMS oscillators from TXC or competitors with identical 4-SMD footprints. Ensure output voltage levels and enable logic polarity match the original design. Cross-reference pinouts carefully as package variations exist within similar form factors.
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