TDA1308T/N2,112

Overview

The TDA1308T/N2,112 is a Class-AB stereo headphone driver fabricated in a 1 μm CMOS process. It operates on a single supply voltage of 3.0 V to 7.0 V or dual supplies of ±1.5 V to ±3.5 V. The device delivers up to 80 mW output power per channel into a 32 Ω load with total harmonic distortion plus noise below 0.1%. Key electrical parameters include a signal-to-noise ratio of 110 dB, a slew rate of 5 V/μs, and a power supply ripple rejection of 90 dB at 100 Hz. It functions within an ambient temperature range of -40 °C to +85 °C.

Feature Summary

• Integrated short-circuit protection for output stage safety
• Elimination of switch-on/off acoustic clicks during operation
• High performance metrics including low distortion and high slew rate
• Excellent power supply ripple rejection capability

Applications

• Portable digital audio applications
• CD player headphone circuits
• Discman headphone drivers
• Optical drive headphone monitoring

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current product status, as availability may vary. Confirm package type matches design requirements, as variants exist in SO8 and TSSOP8 formats. Ensure compliance with RoHS directives if required by the application. Cross-reference the datasheet revision date to confirm technical specifications have not been updated since the component was originally specified.

Selection Notes

Select this component for designs requiring low power consumption and small physical footprint in portable electronics. The wide operating voltage range supports various battery-powered configurations. Verify that the thermal resistance characteristics suit the intended PCB layout and ambient conditions. Consider the input offset voltage and bias current specifications when interfacing with high-impedance source stages.

Part Context

This part belongs to the TDA1308 family of integrated Class-AB stereo headphone drivers developed primarily for portable digital audio equipment. Manufactured using a 1 μm CMOS process, it offers a compact solution for driving headphones in devices like CD players and Discmans. The family includes variations in packaging such as SO8 and TSSOP8 to accommodate different board space constraints.

Replacement Considerations

Consult official NXP documentation for confirmed substitute part numbers. Verify pin compatibility and electrical specifications before substituting.