TDA1519CSP/N3,118

TDA1519CSP/N3,118

  • Description:IC AMP CLSS B MONO/STER 22W 9SMS
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:9e2fd056e9ec Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP CLSS B MONO/STER 22W 9SMS
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Type:Class B
  • Output Type:1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load:22W x 1 @ 4Ohm; 11W x 2 @ 2Ohm
  • Voltage - Supply:6V ~ 17.5V
  • Features:Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type:Through Hole
  • Supplier Device Package:9-SMS
  • Package / Case:SOT-354-1
  • Operating Temperature:-25°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-

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TDA1519CSP/N3,118

Overview

The TDA1519CSP/N3,118 is a Class-B dual output audio power amplifier manufactured by NXP USA Inc. It operates within a supply voltage range of 6.0 V to 17.5 V and delivers up to 22 W in Bridge-Tied Load (BTL) configuration or 11 W per channel in stereo mode at 4 Ω with 10% THD. The device features a fixed gain of 40 dB, low thermal resistance, and integrated protection against short circuits, thermal overload, and reverse polarity.

Feature Summary

  • Integrated mute and standby switch functionality for low-power management
  • Capable of handling high energy on outputs even when the supply voltage is zero
  • Includes comprehensive protection mechanisms such as load dump, AC/DC short-circuit safety, and thermal shutdown

Applications

  • Stereo audio amplification systems
  • Bridge-Tied Load (BTL) speaker configurations
  • Mains-fed consumer electronics such as stereo radios and television sound systems

Procurement Notes

Verify the specific ordering suffix to confirm package type and compliance status. Confirm RoHS3 certification and REACH SVHC declarations prior to integration. Ensure design accounts for the discontinuation status if applicable. Validate that the selected variant matches the required pinout and thermal characteristics for the target application environment.

Selection Notes

Select this component for applications requiring high output power with minimal external components. Consider the BTL capability for maximizing power delivery into 4 Ω loads. Evaluate the fixed 40 dB gain against system input requirements. Ensure adequate PCB copper area for heat dissipation due to the heatsink-on-PCB design of the SMS9P package.

Part Context

This part belongs to the TDA1519 family of integrated class-B dual output amplifiers. It is pin-compatible with the TDA1519B variant. The device is available in multiple packages, including the 9-lead plastic single in-line power package and various 20-lead heatsink small outline packages designed for efficient thermal management.

Replacement Considerations

The TDA1519B is identified as a pin-compatible alternative within the same product family.

TDA1519CSP/N3,118TDA1519CSP/N3,118

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