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Product Detailed Parameters
- Description：IC AMP CLSS B MONO/STER 22W 9SMS
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Type：Class B
- Output Type：1-Channel (Mono) or 2-Channel (Stereo)
- Max Output Power x Channels @ Load：22W x 1 @ 4Ohm; 11W x 2 @ 2Ohm
- Voltage - Supply：6V ~ 17.5V
- Features：Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type：Through Hole
- Supplier Device Package：9-SMS
- Package / Case：SOT-354-1
- Operating Temperature：-25°C ~ 150°C (TJ)
- Grade：-
- Qualification：-
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Overview
The TDA1519CSP/N3C,118 is a Class-B dual output power amplifier in a 9-lead surface-mounted single inline plastic package. It delivers up to 22 W in Bridge-Tied Load (BTL) configuration or 2 x 11 W in stereo mode at 4 Ω with 10% THD. The device operates on a supply voltage ranging from 6 V to 17.5 V and features fixed gain of 40 dB. Key electrical characteristics include low DC output offset voltage, high ripple rejection, and integrated mute/standby functionality.
Feature Summary
- Supports both stereo and BTL configurations with minimal external components
- Integrated mute and standby switch for low current consumption
- Comprehensive protection against short circuits, thermal overload, and reverse polarity
- Eliminates switch-on/off popping noises during operation
Applications
- Automotive audio systems
- Home entertainment equipment
- Portable battery-powered audio devices
Procurement Notes
Verify the specific suffix N3C,112 or similar against official NXP documentation to confirm exact manufacturing lot and environmental compliance status. Confirm pinout compatibility with existing PCB footprints as the SMS9P package has specific mounting requirements. Ensure design accounts for thermal dissipation limits defined in the datasheet derating curves.
Selection Notes
Select this component when a robust Class-B amplifier is required for applications needing high output power in a compact surface-mount form factor. Consider the fixed 40 dB gain and differential input structure for simplified circuit design. Evaluate thermal management needs based on the specific application's ambient temperature and heatsinking capabilities.
Part Context
This part belongs to the TDA1519 family of power amplifiers, which includes variants like the TDA1519CTH and TDA1519CTD. These devices share identical electrical specifications but differ in physical packaging. The TDA1519CSP utilizes a surface-mount SMS9P package designed for automated assembly and space-constrained designs.
Replacement Considerations
The TDA1519CSP is pin-compatible with the TDA1519B and other TDA1519C variants such as the through-hole TDA1519C. Verify that any substitute maintains the same package outline dimensions and thermal characteristics to ensure mechanical fit.
