TDA1519CTD/N3,112

TDA1519CTD/N3,112

  • Description:IC AMP B MONO/STEREO 22W 20HSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube

SKU:14f997448a31 Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP B MONO/STEREO 22W 20HSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube
  • Type:Class B
  • Output Type:1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load:22W x 1 @ 4Ohm; 11W x 2 @ 2Ohm
  • Voltage - Supply:6V ~ 17.5V
  • Features:Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type:Surface Mount
  • Supplier Device Package:20-HSOP
  • Package / Case:20-SOIC (0.433", 11.00mm Width) Exposed Pad
  • Operating Temperature:-25°C ~ 150°C (TJ)
  • Grade:-
  • Qualification:-

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TDA1519CTD/N3,112

Overview

The TDA1519CTD/N3,112 is a Class-B dual output power amplifier in a 20-lead heatsink small outline package (HSOP20). It delivers up to 22 W in Bridge-Tied Load (BTL) mode or 2 x 11 W in stereo configuration. The device operates with a supply voltage range of 6 V to 17.5 V and features fixed gain, low offset voltage, and integrated protection against short circuits, thermal overload, and reverse polarity.

Feature Summary

  • Integrated mute and standby switch functionality for low current consumption
  • AC and DC short-circuit safe operation to ground and supply voltage
  • Thermal protection and load dump protection capabilities
  • Elimination of switch-on/switch-off plops without external components

Applications

  • Stereo audio power amplification systems
  • Bridge-Tied Load (BTL) speaker driving applications
  • Consumer electronics requiring high output power with minimal external components

Procurement Notes

Verify the specific ordering suffix N3,112 against the manufacturer's latest documentation to confirm lead-free compliance and packaging details. Confirm that the HSOP20 package variant matches the required PCB footprint and thermal management strategy. Ensure compatibility with existing design specifications regarding supply voltage and pin configuration before finalizing procurement.

Selection Notes

Select this component for designs requiring a dual-channel Class-B amplifier with integrated protection features. The HSOP20 package facilitates direct heatsinking to the PCB copper area. Consider the fixed 40 dB gain and input impedance requirements when designing the preceding signal stage. Verify thermal dissipation needs based on the intended output power and ambient temperature conditions.

Part Context

This part belongs to the TDA1519C series of power amplifiers manufactured by NXP Semiconductors. The 'TD' designation indicates the 20-lead heatsink small outline package variant where the heatsink faces the PCB. This series is designed for consumer audio applications offering high efficiency and robust protection mechanisms within a compact form factor.

Replacement Considerations

The datasheet states the TDA1519C is pin compatible with the TDA1519B. Designers should verify electrical parameter equivalence between these variants if substitution is considered.

TDA1519CTD/N3,112TDA1519CTD/N3,112

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