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The TDA1519CTD/N3,112 is a Class-B dual output power amplifier in a 20-lead heatsink small outline package (HSOP20). It delivers up to 22 W in Bridge-Tied Load (BTL) mode or 2 x 11 W in stereo configuration. The device operates with a supply voltage range of 6 V to 17.5 V and features fixed gain, low offset voltage, and integrated protection against short circuits, thermal overload, and reverse polarity.
Verify the specific ordering suffix N3,112 against the manufacturer's latest documentation to confirm lead-free compliance and packaging details. Confirm that the HSOP20 package variant matches the required PCB footprint and thermal management strategy. Ensure compatibility with existing design specifications regarding supply voltage and pin configuration before finalizing procurement.
Select this component for designs requiring a dual-channel Class-B amplifier with integrated protection features. The HSOP20 package facilitates direct heatsinking to the PCB copper area. Consider the fixed 40 dB gain and input impedance requirements when designing the preceding signal stage. Verify thermal dissipation needs based on the intended output power and ambient temperature conditions.
This part belongs to the TDA1519C series of power amplifiers manufactured by NXP Semiconductors. The 'TD' designation indicates the 20-lead heatsink small outline package variant where the heatsink faces the PCB. This series is designed for consumer audio applications offering high efficiency and robust protection mechanisms within a compact form factor.
The datasheet states the TDA1519C is pin compatible with the TDA1519B. Designers should verify electrical parameter equivalence between these variants if substitution is considered.