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Product Detailed Parameters
- Description：IC AMP B MONO/STEREO 22W 20HSOP
- Series：-
- Mfr：NXP USA Inc.
- Package：Tape & Reel (TR)
- Type：Class B
- Output Type：1-Channel (Mono) or 2-Channel (Stereo)
- Max Output Power x Channels @ Load：22W x 1 @ 4Ohm; 11W x 2 @ 2Ohm
- Voltage - Supply：6V ~ 17.5V
- Features：Depop, Mute, Short-Circuit and Thermal Protection, Standby
- Mounting Type：Surface Mount
- Supplier Device Package：20-HSOP
- Package / Case：20-SOIC (0.433", 11.00mm Width) Exposed Pad
- Operating Temperature：-25°C ~ 150°C (TJ)
- Grade：-
- Qualification：-
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Overview
The TDA1519CTH/N3C,118 is an integrated Class-B dual output audio power amplifier manufactured by NXP Semiconductors. It delivers up to 22 W in Bridge-Tied Load (BTL) configuration or 2 x 11 W in stereo mode with a 4 Ω load at 14.4 V supply and 10% THD. The device operates within a supply voltage range of 6.0 V to 17.5 V and features a fixed closed-loop voltage gain of 40 dB for stereo applications. It utilizes a 20-lead HSOP plastic heatsink small outline package (SOT418-3) designed for low stand-off height.
Feature Summary
- Integrated BTL operation requiring minimal external components
- Mute/standby switch with low standby current consumption
- Comprehensive protection against short circuits, thermal overload, reverse polarity, and load dumps
- Low DC output offset voltage optimized for BTL configurations
Applications
- Stereo audio amplification systems
- Bridge-tied load speaker driving
- Automotive radio power stages
- Consumer electronics audio outputs
Procurement Notes
Verify the specific ordering suffix /N3C,118 against the official NXP datasheet to confirm exact packaging and compliance attributes. Confirm that the HSOP20 SOT418-3 package variant matches the required mechanical constraints. Ensure design compatibility with the specified 6V to 17.5V operating range before procurement.
Selection Notes
Select this component for designs requiring high output power in a compact form factor. The top-mounted heatsink on the TDA1519CTH allows for direct attachment of external cooling solutions. Verify that the application supports the fixed 40 dB gain characteristic and requires the specific pinout configuration provided by the 20-lead HSOP package.
Part Context
This part belongs to the TDA1519 series of integrated audio power amplifiers. It shares functional similarities with the TDA1519B but offers enhanced performance metrics. The TDA1519CTH specifically denotes the version with a top-heatsink configuration, distinct from the through-hole SIL9P or bottom-heatsink HSOP20 variants.
Replacement Considerations
The TDA1519CSP is pin-compatible with the TDA1519C series. Designers should verify if the surface-mount SMS9P package meets the thermal and spatial requirements as an alternative to the HSOP20.
