TDA51S485HC

Overview

The TDA51S485HC is a half-duplex RS-485 digital isolator manufactured by Mornsun America, LLC. It integrates an efficient isolated DC-DC converter with the transceiver circuit in a 16-SOIC package. The device supports I/O voltages of 3.3V and 5V microprocessors and operates within a supply voltage range of 3V to 5.5V. It achieves a communication rate of up to 1Mbps with a low quiescent current of 15mA. The module provides high isolation performance, featuring an isolation withstand voltage of 5000Vrms and bus ESD protection up to 15kV (HBM). It supports up to 256 nodes on the bus and functions reliably in industrial environments from -40°C to +125°C.

Feature Summary

• Integrates high-efficiency isolated power supply with digital isolation for compact design
• Supports both 3.3V and 5V microprocessor I/O voltage levels
• Provides robust bus protection including ESD, short-circuit, and fail-safe features

Applications

• Industrial automation systems
• Building automation networks
• Smart metering infrastructure
• Remote signal interaction and transmission

Procurement Notes

Verify component authenticity through authorized Mornsun distributors or direct channels. Confirm that the specific order suffix matches the required packaging format, such as tape and reel or cut tape, as indicated on the datasheet. Ensure compliance with RoHS3 standards and check for any specific handling requirements related to moisture sensitivity level 3 prior to assembly.

Selection Notes

Select this model when a compact SOIC-16 footprint is preferred over chip-scale DFN packages while maintaining integrated isolation power. It is suitable for designs requiring support for both 3.3V and 5V logic interfaces without external level shifters. Consider its 1Mbps data rate and 5000Vrms isolation capability for standard industrial RS-485 applications where space constraints exist but full chip-level miniaturization is not mandatory.

Part Context

The TDA51S485HC belongs to Mornsun's R5 series of bus isolation transceivers. This family focuses on integrating power isolation and digital isolation into a single chip to reduce system complexity. Compared to the TD541S485H which uses a DFN package, this variant utilizes a 16-SOIC form factor, offering different PCB layout considerations while providing similar core isolation and communication functionalities for RS-485 networks.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult official Mornsun resources for pin-to-pin compatible alternatives within the R5 series, such as other variants in the TDA51S485HC family, if specific package or parameter adjustments are required.