TDA7297D13TR

Overview

The TDA7297D13TR is a dual bridge audio amplifier manufactured by STMicroelectronics, designed for home audio, plasma TV, and LCD TV applications. It operates within a supply voltage range of 6.5V to 18V and delivers an output power of 10W per channel at THD=10% with an 8Ω load and 13V supply. The device utilizes BI20II technology and features internally fixed gain, eliminating the need for external SVR capacitors, bootstrap circuits, or Boucherot cells. It includes stand-by and mute functions, short circuit protection, and thermal overload protection.

Feature Summary

• Dual bridge architecture optimized for television and home audio systems
• Integrated thermal overload and short circuit protection mechanisms
• Simplified design requiring no external bootstrap, SVR, or Boucherot components
• Operational standby and mute control capabilities

Applications

• Home Audio Systems
• Plasma Television Sets
• LCD Television Sets

Procurement Notes

Verify component authenticity through authorized distributors as this part may be obsolete. Confirm package orientation (PowerSO-20 slug up) and lead coplanarity against mechanical drawings. Ensure ESD handling protocols are followed during storage and assembly due to semiconductor sensitivity.

Selection Notes

Select this component for designs requiring high efficiency without complex external filtering networks. Suitable for single-supply implementations where internal gain stability is required. Evaluate thermal dissipation requirements based on ambient temperature and enclosure constraints.

Part Context

This model belongs to the TDA7297 series of dual bridge amplifiers. It shares core functional specifications with other variants in the family but differs in packaging and tape-and-reel configuration. The D13 suffix typically indicates specific reel dimensions or manufacturing lot codes.

Replacement Considerations

Consult official substitution lists for equivalent dual bridge amplifiers if availability is restricted. Verify pin compatibility and thermal resistance values before integrating alternative components into existing layouts.