TDA7449

Audio Special Purpose Overview

The TDA7449 is a two-channel volume control integrated circuit manufactured by STMicroelectronics, designed for consumer audio applications. It operates on a supply voltage range of 6V to 10.2V and supports I2C interface communication. The device provides a specification of 100dB and functions within an ambient temperature range of 0°C to 70°C. It is housed in a 20-DIP package with a width of 0.300 inches (7.62mm) and utilizes through-hole mounting. This component is intended for precise audio level management in stereo systems.

Audio Special Purpose Feature Summary

• Two-channel volume control with I2C digital interface
• 100dB dynamic range specification
• Supply voltage operation from 6V to 10.2V
• 20-DIP through-hole package

Audio Special Purpose Applications

• Consumer audio equipment
• Stereo volume control circuits

Audio Special Purpose Procurement Notes

Verify the specific package variant required, as the TDA7449 family includes both DIP and SOIC options such as the TDA7449D13TR. Confirm current availability status, as some variants may be discontinued or have limited stock. Ensure the design supports the 6V to 10.2V supply range and I2C bus requirements before ordering.

Audio Special Purpose Selection Notes

Select the TDA7449 when a two-channel digital volume controller with I2C control is needed for consumer audio. Ensure the PCB layout accommodates the 20-DIP footprint if using the standard DIP version. Verify that the system power supply remains within the 6V to 10.2V operating range for proper functionality.

Audio Special Purpose Part Context

The TDA7449 belongs to STMicroelectronics' portfolio of audio special purpose integrated circuits. It serves as a dedicated solution for managing audio levels in stereo setups, distinct from amplifier ICs like the TDA7492 or memory devices like the M24512 found in related product listings.

Audio Special Purpose Replacement Considerations

Check for pin-compatible alternatives if the 20-DIP package is unavailable. Consider the TDA7449D13TR for surface-mount applications, noting the change from DIP to SOIC packaging.