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The TDA7801H is a quad bridge audio power amplifier designed for automotive applications, manufactured by STMicroelectronics. It features a 27-Flexiwatt through-hole package with horizontal formed leads. The device supports I2C, I2S, and TDM interfaces and operates on an 8V to 18V supply voltage. It delivers up to 72W of output power across four channels. Key specifications include a 115dB signal-to-noise ratio and an operating temperature range of -40°C to 105°C. This component is classified as an automotive-grade audio amplifier.
Verify the specific suffix 'H' against official datasheets to confirm pinout and thermal characteristics differ from other variants like the PD or standard TDA7801. Confirm current availability status as previous TDA7801 models have been marked obsolete in some distributor records. Ensure the 27-Flexiwatt horizontal package matches the target PCB footprint requirements.
Select this model when a through-hole mounting solution is required for high-power automotive audio designs. The 27-Flexiwatt package provides robust thermal dissipation capabilities suitable for vertical or horizontal mounting configurations. Verify that the system design accommodates the 8V to 18V supply range and utilizes I2C/I2S/TDM compatible controllers for configuration and digital audio input.
The TDA7801H belongs to the TDA7801 family of BCD technology quad bridge amplifiers. While the base TDA7801 integrates D/A conversion and MOSFET outputs, the H variant specifically denotes the 27-Flexiwatt through-hole package form factor. This distinguishes it from surface-mount options like the PowerSO-36 (PD) version, offering flexibility for different assembly processes in automotive electronics.
The TDA7801PD serves as a surface-mount alternative within the same functional family but uses a PowerSO-36 package. Direct replacement requires verifying PCB layout compatibility due to the difference between through-hole Flexiwatt and surface-mount PowerSO footprints. Check if the application can accommodate the change in mounting type and thermal management strategy.