TDA8552TS/N1,112

TDA8552TS/N1,112

  • Description:IC AMP CLASS AB STER 1.4W 20SSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube

SKU:080583946bd5 Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP CLASS AB STER 1.4W 20SSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube
  • Type:Class AB
  • Output Type:2-Channel (Stereo)
  • Max Output Power x Channels @ Load:1.4W x 2 @ 8Ohm
  • Voltage - Supply:2.7V ~ 5.5V
  • Features:Depop, Mute, Short-Circuit and Thermal Protection, Standby, Volume Control
  • Mounting Type:Surface Mount
  • Supplier Device Package:20-SSOP
  • Package / Case:20-LSSOP (0.173", 4.40mm Width)
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-

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TDA8552TS/N1,112

Overview

The TDA8552TS/N1,112 is a two-channel audio power amplifier in a 20-pin SSOP package. It delivers 2 x 1.4 W into an 8 Ω load at 5 V supply with THD = 10%. Supply voltage ranges from 2.7 V to 5.5 V. Quiescent current is typically 14 mA in BTL mode at 5 V and 11 μA in standby. Gain is selectable at 20 dB or 30 dB via the GAINSEL pin. Volume control offers 64 steps with up/down pulses. Headphone sensing switches the device from BTL to SE mode.

Feature Summary

  • Digital volume control with up/down pulse interface and auto-repeat function
  • Headphone sensing capability that automatically switches between BTL and SE modes
  • Internal thermal shutdown protection and short-circuit safe outputs
  • Low standby current consumption with CMOS compatible mode selection

Applications

  • Portable consumer products
  • Notebook computers
  • Communication equipment

Procurement Notes

Verify the specific ordering suffix N1,112 against the manufacturer's latest documentation to confirm packaging details and compliance status. Ensure the SSOP20 package variant matches the thermal design requirements of the target application board layout for adequate heat dissipation.

Selection Notes

Select this component when digital volume control and headphone detection are required in a compact form factor. The SSOP20 package is suitable for space-constrained designs but requires careful PCB thermal management due to higher thermal resistance compared to the SO20 variant. Verify gain settings and supply voltage compatibility with the system architecture.

Part Context

This part belongs to the TDA8552 family of integrated circuits manufactured by NXP Semiconductors. It is specifically the shrink small outline package version (TDA8552TS) distinguished by its reduced body width. The family provides dual bridge-tied load amplifiers designed for low-power audio applications requiring integrated control features.

Replacement Considerations

The TDA8552T is the equivalent component in the SO20 package. Both share identical electrical characteristics and functionality, differing only in physical package dimensions and thermal performance profiles.

TDA8552TS/N1,112TDA8552TS/N1,112

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