TDA8922CTH/N1,112

Overview

The TDA8922CTH/N1,112 is a high-efficiency Class D audio power amplifier manufactured by NXP Semiconductors. It operates within a symmetrical supply voltage range of ±12.5 V to ±32.5 V and features low quiescent current consumption. The device provides typical output power of 2 × 75 W in stereo single-ended configuration with a 6 Ω load at ±30 V, or 1 × 155 W in mono bridge-tied load configuration with an 8 Ω load at ±25 V. It utilizes BD modulation in BTL mode and includes advanced protection strategies such as thermal foldback and overcurrent protection.

Feature Summary

• Pin compatible with TDA8950/20C for both HSOP24 and DBS23P packages
• Stereo full differential inputs supporting stereo Single-Ended (SE) or mono Bridge-Tied Load (BTL) configurations
• Advanced protection strategy including voltage protection, output current limiting, and Thermal FoldBack (TFB)
• Smooth pop noise-free start-up and switch off with zero dead time switching

Applications

• DVD systems
• Mini and micro receivers
• Home Theater In A Box (HTIAB) systems
• High-power speaker systems

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to confirm package type and reel specifications. Ensure compatibility with existing PCB footprints, particularly regarding the HSOP24 package dimensions. Confirm that the component meets all required environmental standards and RoHS compliance levels for the intended deployment region before finalizing procurement orders.

Selection Notes

Select this amplifier for applications requiring high output power efficiency and low distortion. Consider the fixed gain settings of 30 dB in SE and 36 dB in BTL modes when designing the input stage. Evaluate the thermal management requirements based on the expected operating temperature and load impedance to ensure optimal performance and reliability under continuous use conditions.

Part Context

The TDA8922CTH/N1,112 belongs to the TDA8922C series of Class D audio amplifiers from NXP Semiconductors. This series is designed for high-performance audio applications where efficiency and power output are critical. The TH suffix indicates the HSOP24 plastic heatsink small outline package variant, which is suitable for surface mount assembly and provides effective thermal dissipation capabilities for high-power operations.

Replacement Considerations

The datasheet explicitly states pin compatibility with the TDA8950/20C for both HSOP24 and DBS23P packages. Designers should verify electrical parameter overlaps and thermal characteristics before substituting these parts in existing designs.