TDA8931T/N1,118

Overview

The TDA8931T/N1,118 is a Class-D audio power amplifier IC manufactured by NXP USA Inc. It features a single-ended switching power stage with integrated drive logic, protection circuits, and a half-supply voltage charger for the SE capacitor. Designed for high efficiency, it supports asymmetrical supply voltages from 12 V to 35 V and symmetrical supplies from ±6 V to ±17.5 V. The device delivers up to 22 W output power into a 4 Ω load at 26 V supply. It operates within an ambient temperature range of -40°C to +85°C and utilizes a 20-SOIC package.

Feature Summary

• Integrated single-ended power stage with differential input comparator
• Built-in protection against overtemperature, overcurrent, overvoltage, and undervoltage
• Eliminates pop noise during startup and shutdown sequences
• High efficiency design reduces thermal requirements

Applications

• Flat panel television sets
• Flat panel monitors
• Multimedia systems
• Wireless speakers
• Micro systems

Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status and check for obsolescence notices as the part may be discontinued. Ensure proper handling procedures are followed due to surface mount packaging. Validate that the specific suffix matches the required pinout and thermal characteristics for your PCB layout.

Selection Notes

Select this component for compact digital amplifier designs requiring high efficiency without external heat sinks. Consider the asymmetrical supply capability for simplified power architectures. Evaluate the internal protection features to reduce external circuit complexity. Ensure the application environment stays within the specified operating temperature limits for reliable performance.

Part Context

This component belongs to the TDA893 series of Class-D audio amplifiers. It represents a switching power stage solution optimized for self-oscillating digital amplifier systems. The family focuses on delivering high audio fidelity with minimal external components. It is designed for integration into consumer electronics where space and thermal management are critical constraints.

Replacement Considerations

Check for pin-compatible alternatives within the same product family. Verify that substitute parts maintain similar efficiency curves and protection thresholds. Ensure replacement packages match the SO20 footprint and thermal pad requirements.