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The TDA8932BTW/N2,118 is a high-efficiency Class-D audio amplifier manufactured by NXP USA Inc. in a 32-lead HTSSOP package with an exposed die pad. It supports stereo single-ended or mono bridge-tied load configurations. Operating from a supply voltage of 10 V to 36 V asymmetrical or ±5 V to ±18 V symmetrical, it delivers up to 15 W per channel at 4 Ω (stereo) or 30 W in mono BTL mode at 8 Ω. The device features integrated thermal foldback and protection circuits, enabling heat sink-free operation under typical music signals.
Verify the specific ordering suffix against the manufacturer's official documentation to confirm packaging type and compliance status. Confirm component availability as distribution channels may list discontinued stock. Ensure the HTSSOP32 package variant matches the design requirements for thermal management and pin compatibility before finalizing procurement orders.
Select this component for designs requiring high efficiency and low power dissipation in compact audio systems. Evaluate the thermal resistance characteristics of the PCB layout to ensure adequate heat sinking for continuous high-power operation. Consider the differential input configuration for noise immunity and verify that the supply voltage range aligns with the system's power architecture.
This part belongs to the TDA8932B family of Class-D audio amplifiers designed for high-performance audio applications. It shares functional similarities with other members like the TDA8933B but offers specific output power ratings and protection features tailored for stereo and mono configurations. The HTSSOP32 package provides a thermally enhanced solution for space-constrained designs.
TDA8932BTW/N2,112
The TDA8932B utilizes thermal foldback to gradually decrease gain when junction temperature exceeds 140 °C, maintaining operation at lower power levels. If the temperature reaches 155 °C, the OverTemperature Protection (OTP) shuts down the power stage immediately.
The DIAG pin serves as an open-drain diagnostic output. It is forced LOW when any protection mechanism other than thermal foldback is triggered, allowing the system to detect faults such as overcurrent, short circuits, or supply voltage anomalies.
Yes, the device supports master-slave configuration. By connecting OSCIO pins together and configuring one unit as master via an external resistor on OSCREF, multiple TDA8932B devices can operate with synchronized switching frequencies to minimize interference.