TDA8933BTW/N2,112

Overview

The TDA8933BTW/N2,112 is a high-efficiency Class D audio amplifier manufactured by NXP USA Inc. It features two full differential inputs driving independent outputs, supporting mono full-bridge (BTL) or stereo half-bridge (SE) configurations. The device operates with an asymmetrical supply voltage from 10 V to 36 V or symmetrical ±5 V to ±18 V. In stereo SE mode with RL=8 Ω and VP=25 V, it delivers 10.3 W RMS output power. In mono BTL mode with RL=16 Ω and VP=25 V, it provides 20.6 W RMS. It includes thermal foldback, current limiting, and short-circuit protection.

Feature Summary

• High efficiency Class D architecture with low power dissipation suitable for heat sink-free operation
• Dual fully differential inputs enabling flexible mono bridge-tied load or stereo single-ended applications
• Integrated thermal foldback and overcurrent protection to prevent audio interruptions during fault conditions
• Pop-noise free start-up sequence with configurable master-slave oscillator synchronization

Applications

• Flat-panel television sets
• Flat-panel monitor sets
• Multimedia systems
• Wireless speakers
• Mini/micro systems

Procurement Notes

Verify the specific ordering suffix /N2,112 against the manufacturer's current production status, as this variant may be discontinued. Confirm package details match the HTSSOP32 specification with exposed die pad. Ensure environmental compliance data aligns with project requirements before finalizing procurement orders.

Selection Notes

Select this component for designs requiring high output power in compact form factors without external heatsinks. Consider the thermal resistance characteristics of the PCB layout when operating at high supply voltages. Verify that the application supports the required differential input configuration and that the supply voltage range matches the system power rails.

Part Context

This part belongs to the TDA8933B family of Class D audio amplifiers. It shares functional similarities with the TDA8932B but offers specific output power capabilities tailored for stereo and mono bridge configurations. The device utilizes a plastic thermal enhanced thin shrink small outline package designed for efficient heat dissipation in space-constrained audio applications.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.