TDA8947J/N3,112

TDA8947J/N3,112

  • Description:IC AMP CLASS AB QUAD 29W DBS17P
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube

SKU:72f5bfa08da5 Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP CLASS AB QUAD 29W DBS17P
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tube
  • Type:Class AB
  • Output Type:4-Channel (Quad)
  • Max Output Power x Channels @ Load:29W x 2 @ 8Ohm; 14W x 4 @ 4Ohm
  • Voltage - Supply:9V ~ 26V
  • Features:Depop, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type:Through Hole
  • Supplier Device Package:DBS17P
  • Package / Case:17-SIP Formed Leads
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-

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TDA8947J/N3,112

Overview

The TDA8947J is a four-channel audio power amplifier integrated circuit designed for versatile multi-speaker configurations. It supports four single-ended channels at 26 dB gain, two bridge-tied load channels at 32 dB gain, or a hybrid 2.1 system setup. Operating within a supply voltage range of 9 V to 26 V, the device delivers up to 25 W per channel in single-ended mode and 50 W in bridge-tied load mode. It utilizes a 17-pin Dil-Bent-Sil package and features comprehensive protection mechanisms including thermal shutdown and short-circuit prevention.

Feature Summary

  • Integrated unique protection circuit based on multiple internal temperature measurements
  • Flexible configuration supporting single-ended, bridge-tied load, and 2.1 system modes
  • Pin compatible with TDA8944AJ and TDA8946AJ for simplified design upgrades
  • Low standby current consumption with mute and standby operational modes

Applications

  • Television audio systems
  • PC speaker enclosures
  • Boom box portable audio devices
  • Mini and micro audio receivers

Procurement Notes

Verify component authenticity through authorized NXP distributors. Confirm package integrity upon receipt as the DBS17P housing requires careful handling during wave soldering processes. Ensure compliance with RoHS directives if applicable to the specific manufacturing batch requirements.

Selection Notes

Select this amplifier for designs requiring high output power density from a single chip. The flexible gain structure allows optimization for various speaker impedances. Consider thermal management requirements carefully, as maximum power dissipation depends heavily on ambient temperature and heatsink efficiency.

Part Context

Originally developed by Philips Semiconductors, this component is now managed under the NXP portfolio. It serves as a direct pin-compatible replacement for the TDA8944AJ and TDA8946AJ series, allowing manufacturers to upgrade audio capabilities without redesigning printed circuit board layouts.

Replacement Considerations

TDA8944AJ

FAQ

How does the protection circuit prevent audio holes?

The protection circuit relies on multiple internal temperature sensors. It activates only when necessary, allowing pulsed current flow during shorts without completely shutting down, thus maintaining audio output where possible.

What is the required minimum load impedance at high supply voltages?

For supply voltages exceeding 22 V, a minimum load of 3 Ω is required for Single-Ended operation and 6 Ω for Bridge-Tied Load operation to ensure safe performance.

TDA8947J/N3,112TDA8947J/N3,112

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