TDA8954TH/N1,112

Overview

The TDA8954TH/N1,112 is a stereo or mono high-efficiency Class D audio power amplifier by NXP Semiconductors. It delivers up to 2 × 210 W into a 4 Ω load in stereo Single-Ended configuration or 1 × 420 W into an 8 Ω load in Bridge-Tied Load mode. Operating over a supply voltage range of ±12.5 V to ±42.5 V, it features low quiescent current consumption and audiophile sound quality comparable to Class AB amplifiers. The device includes two diagnostic pins for monitoring Thermal Fold Back and Over Current Protection status.

Feature Summary

• High output power with approximately 93% efficiency
• Stereo full differential inputs supporting SE or BTL configurations
• Advanced protection strategy including thermal foldback and overcurrent limiting
• Smooth pop noise-free start-up and switch-off

Applications

• Digital Video Disc (DVD) systems
• Home Theater In A Box (HTIAB) systems
• Mini and micro receivers
• High-power speaker systems
• Public Address (PA) systems

Procurement Notes

Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct package type and reel specifications. Confirm availability status directly with authorized distributors as stock levels fluctuate. Ensure compliance with RoHS directives and environmental regulations relevant to your region before finalizing procurement orders.

Selection Notes

Select this component for applications requiring high power density and efficient heat management. Consider the HSOP24 package for its heatsink capabilities. Evaluate the need for external clock synchronization if multiple units are used together to prevent beat tones. Ensure the power supply can handle the peak current demands during operation.

Part Context

This part belongs to the TDA8954 series of Class D power amplifiers from NXP Semiconductors. The TH variant specifically denotes the HSOP24 plastic heatsink small outline package. This series is designed for high-performance audio applications where size, weight, and efficiency are critical constraints compared to traditional linear amplifiers.

Replacement Considerations

Consult the official NXP replacement guide for verified substitutes. Direct replacements must match the HSOP24 package and electrical characteristics. Cross-referencing with similar series parts requires careful verification of pin compatibility and thermal performance.

FAQ

How is the carrier frequency determined?

The carrier frequency is set by an external resistor connected between the OSC and OSCREF pins. A typical value of 30 kΩ sets the frequency to approximately 335 kHz.

What is the function of the DIAG1 pin?

DIAG1 provides a warning signal when Thermal Fold Back (TFB) is activated, indicating that the junction temperature has exceeded the threshold and gain is being reduced.