TDF8591TH/N1,118

TDF8591TH/N1,118

  • Description:IC AMP D MONO/STEREO 310W 24HSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)

SKU:cd42ab9361af Category: Brand:

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Product Detailed Parameters

  • Description:IC AMP D MONO/STEREO 310W 24HSOP
  • Series:-
  • Mfr:NXP USA Inc.
  • Package:Tape & Reel (TR)
  • Type:Class D
  • Output Type:1-Channel (Mono) or 2-Channel (Stereo)
  • Max Output Power x Channels @ Load:310W x 1 @ 4Ohm; 100W x 2 @ 4Ohm
  • Voltage - Supply:±14V ~ 29V
  • Features:Depop, Differential Inputs, Mute, Short-Circuit and Thermal Protection, Standby
  • Mounting Type:Surface Mount
  • Supplier Device Package:24-HSOP
  • Package / Case:24-BSOP (0.433", 11.00mm Width) Exposed Pad
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Grade:-
  • Qualification:-

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TDF8591TH/N1,118

Overview

The TDF8591TH is a high-efficiency Class-D audio power amplifier designed for car audio systems. It features dual channels capable of delivering 2 × 100 W into 4 Ω in Single-Ended (SE) configuration, or 310 W into 4 Ω in Bridge-Tied Load (BTL) mode. The device operates on a supply voltage range from ±14 V to ±29 V and includes an internal heat sink within its HSOP24 package. It supports fixed gains of 26 dB in SE and 32 dB in BTL configurations.

Feature Summary

  • Zero dead time switching minimizes distortion during transitions.
  • Advanced protection mechanisms include thermal foldback, overtemperature shutdown, and full short-circuit proof outputs.
  • Differential inputs provide high common-mode rejection and flexible mono BTL or stereo SE operation.
  • Internal oscillator allows synchronization with external clocks for multi-amplifier systems.

Applications

  • Car audio systems
  • Mono Bridge-Tied Load (BTL) speaker setups
  • Stereo Single-Ended (SE) speaker setups

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to ensure compatibility with required packaging or environmental standards. Confirm that the HSOP24 package variant matches the thermal management requirements of the target application design.

Selection Notes

Select this component for applications requiring high output power efficiency with minimal external heat sinking. Ensure the load impedance falls within the 2 Ω to 8 Ω range. Designers must account for the differential input requirement and implement appropriate RC networks on the MODE pin to manage startup pop noise.

Part Context

This part belongs to NXP's portfolio of automotive-grade audio amplifiers. It utilizes Class-D technology to achieve high efficiency and low quiescent current. The device is AEC-Q100 qualified, ensuring reliability for automotive environments where wide temperature ranges and robust protection are critical.

Replacement Considerations

Check for updated revisions of the TDF8591 series. Verify pinout compatibility if substituting with other NXP Class-D amplifiers. Ensure replacement parts support the same supply voltage range and thermal dissipation characteristics.

FAQ

How is the switching frequency determined?

The frequency is set by an external resistor connected between the OSC pin and VSSA. An optimum setting is between 300 kHz and 350 kHz, typically achieved with a 30 kΩ resistor.

What happens if the junction temperature exceeds 160 °C?

The OverTemperature Protection (OTP) circuit will immediately shut down the power stage to prevent damage.

Can the amplifier operate without an external heat sink?

Yes, depending on the supply voltage and load conditions, the small internal heat sink may allow operation without an external heat sink, though thermal resistance calculations are recommended.

TDF8591TH/N1,118TDF8591TH/N1,118

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