TE0600-03-52I11-M

Overview

The Trenz Electronic TE0600-03-52I11-M is an industrial-grade System-on-Module (SOM) based on the Xilinx Spartan-6 LX FPGA. It integrates a Marvell Alaska Ethernet PHY for 10/100/1000 Mbps connectivity, two 16-bit wide DDR3 SDRAM chips providing up to 512 MB of memory, and a 128 Mb SPI Flash for configuration. The module features a compact 4x5 cm footprint with dual B2B connectors offering extensive I/O access. It operates within an industrial temperature range and includes onboard power regulation, a watchdog timer, and a protected 1-Wire EEPROM.

Feature Summary

• Xilinx Spartan-6 LX FPGA core
• Integrated Gigabit Ethernet PHY (Marvell 88E1111)
• Up to 512 MB DDR3 SDRAM (2 x 16-bit)
• Industrial temperature rating (-40°C to +85°C)

Applications

• Industrial automation controllers
• Embedded data acquisition systems
• Networked measurement devices

Procurement Notes

Verify the specific FPGA density (LX45, LX100, or LX150) and memory capacity (128 MB or 512 MB) associated with the -52I11 suffix against the official datasheet. Confirm that the industrial temperature grade matches the application requirements. Check for current availability as this series may be subject to discontinuation notices.

Selection Notes

Select this module when a ruggedized FPGA solution with integrated high-speed networking and significant memory is required in a small form factor. Ensure the carrier board supports the 3.3V nominal supply voltage and provides adequate thermal management for the switching regulators. Verify that the B2B connector mating height aligns with the mechanical design constraints.

Part Context

This module belongs to the Trenz Electronic GigaBee XC6SLX family, designed for applications requiring robust FPGA processing with embedded peripherals. It utilizes standard Samtec Razor Beam connectors for reliable board-to-board interfacing. The platform is intended for integration into custom baseboards for specialized embedded computing tasks.

Replacement Considerations

No direct public substitutes are listed. Consider other modules from the same manufacturer's portfolio if newer technology is required, ensuring compatibility with existing carrier board designs or planning for new hardware development.