TE0600-04-83I11-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0600-04-83I11-A is an industrial-grade FPGA micromodule from Trenz Electronic's GigaBee series. It integrates an AMD Spartan-6 LX FPGA (XC6SLX25, Speedgrade -3L) in an FGG484 package. The module includes 512 MByte of 16-bit-wide DDR3 SDRAM and 16 MByte QSPI Flash for configuration. Power management is handled by onboard DCDC converters providing 3.3V, 1.2V, 1.5V, and 2.5V rails. Connectivity is provided via three board-to-board LSHM connectors supporting up to 104 single-ended or 52 differential I/Os, alongside a Gigabit Ethernet PHY.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• FPGA: AMD Spartan-6 LX XC6SLX25FGG484 (-3L speedgrade)
• Memory: 512 MB DDR3 SDRAM and 16 MB QSPI Flash
• Connectivity: 3x LSHM B2B connectors with 10/100/1000 Mbps Ethernet PHY
• Temperature Range: Industrial grade (-40°C to +85°C ambient)

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation controllers requiring ruggedized processing
• Embedded systems with high-speed serial communication needs
• Network infrastructure equipment utilizing Gigabit Ethernet

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific FPGA capacity and speedgrade suffixes against the official Trenz Electronic product catalog to ensure compatibility with the required design constraints. Confirm that the industrial temperature rating aligns with the operational environment specifications before finalizing the order.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when an industrial-rated Spartan-6 solution with integrated memory and power management is required. Ensure the baseboard design supports the 3.3V main supply and the EN signal sequencing. Verify that the available I/O count on the LSHM connectors meets the system interface requirements.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0600 series of GigaBee modules, which are designed as System-on-Module solutions based on AMD Spartan-6 FPGAs. The series offers various FPGA densities and temperature grades, standardized around a 50mm x 40mm form factor with robust board-to-board connectivity options.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

No direct public substitutes are listed. Consider other TE0600 variants with different FPGA densities or temperature grades if the specific XC6SLX25 parameters do not match the application requirements.