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TE0600-04-83I21-A is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC MODULE GIGABEE. Review the specifications below when checking this part for your BOM.
The TE0600-04-83I21-A is an industrial-grade FPGA micromodule from the Trenz Electronic GigaBee (TE0600) series. It integrates an AMD Spartan-6 LX XC6SLX150-2 FPGA in an FGG484 package, operating within a temperature range of -40°C to +85°C. The module provides 512 MByte of 16-bit-wide DDR3 SDRAM and 16 MByte of QSPI Flash for configuration. Onboard peripherals include a Gigabit Ethernet PHY, two oscillators (100 MHz and 25 MHz), and DCDC converters for all voltage rails. Connectivity is established via three board-to-board LSHM connectors offering up to 104 single-ended or 52 differential I/Os.
Verify the specific ordering suffix against the official Trenz Electronic article number information table to confirm the exact FPGA speedgrade, memory capacity, and temperature range. Ensure baseboard design adheres to the recommended power-up sequencing and connector mating height specifications provided in the technical reference manual.
Select this variant for applications requiring the maximum logic density of the Spartan-6 LX family (XC6SLX150). Confirm that the baseboard supports the required 3.3V main supply and VCCIO0 voltage rails within the specified operating ranges. Verify thermal management requirements as the actual operating temperature depends on the cooling solution and ambient conditions.
This module belongs to the TE0600 series, which are 4x5 form factor micromodules designed for integration into custom carrier boards. The series utilizes Samtec Razor Beam LSHM connectors for board-to-board interfacing. The TE0600-04-83I21-A represents a specific assembly variant with defined memory and temperature characteristics within this product line.
Publicly confirmed substitute part numbers are not available in the provided documentation. As this is a specialized FPGA micromodule, direct replacement requires verifying pin compatibility, electrical specifications, and mechanical dimensions with the target baseboard design.
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