TE0712-03-72C36-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0712-03-72C36-A is a micromodule based on the AMD Artix-7 XC7A100T FPGA. It features a 484-pin FGG package and provides extensive I/O connectivity through four banks: Bank 13 (10 IOs), Bank 14 (8 IOs), Bank 15 (18 IOs), and Bank 16 (48 IOs). The module includes integrated DDR3 SDRAM, QSPI flash memory, an Ethernet PHY, and a system controller. Power rails include VIN (3.3V to 5V), 3.3VIN, 1.5V, 1.8V, and dedicated MGT supplies.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Core processor utilizes the Xilinx Artix-7 XC7A100T FPGA in a 484-ball FGG package.
• Includes onboard DDR3 SDRAM for data storage and QSPI flash for configuration.
• Features an integrated Ethernet PHY supporting 100Base-TX connectivity.
• Provides multiple power domains including 1.5V, 1.8V, and 3.3V outputs for carrier card periphery.

Microcontrollers, Microprocessor, FPGA Modules Applications

• Embedded logic design and prototyping
• Industrial automation control systems
• High-speed digital signal processing interfaces

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific assembly variant 72C36-L against project requirements. Confirm that the required FPGA speed grade matches the module's specifications. Ensure the carrier board supports the B2B connector pinout defined in the schematic documentation.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when high-density I/O is required, specifically utilizing Bank 16's 48 pins. Note that Bank 13 signals are not available if using smaller Artix-7 variants like the 15T, 35T, or 50T; verify the exact chip size before ordering.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the Trenz Electronic TE0712 series of modules designed for the AMD Artix-7 family. It serves as a compact solution for integrating programmable logic into custom carrier boards via standardized B2B connectors.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements require matching the XC7A100T FPGA core and the specific B2B connector footprint. Verify pin compatibility with the carrier board, particularly regarding the availability of Bank 13 signals which vary by FPGA density.