TE0712-03-82C36-L

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0712-03-82C36-L is a micromodule from Trenz Electronic GmbH featuring the Xilinx Artix-7 XC7A200T FPGA in a 484-ball FBGA package. It provides 48 IOs across Bank 16, 20 IOs in Bank 13, 18 IOs in Bank 15, and 8 IOs in Bank 14. The module includes four MGT GTP transceivers, DDR3 SDRAM, QSPI flash memory, an Ethernet PHY, and a system controller. Recommended operating conditions specify a VIN input range of 3.0 to 5.5V with a tolerance of +/-5%, and a 3.3VIN input range of 3.3V with a tolerance of +/-3%.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Artix-7 XC7A200T FPGA with 484-ball FBGA package
• Integrated DDR3 SDRAM and QSPI flash memory
• Four MGT GTP high-speed serial transceivers
• Onboard Ethernet PHY supporting 100Base-TX connectivity
• System controller with power monitors for voltage sequencing

Microcontrollers, Microprocessor, FPGA Modules Applications

• Embedded logic design and prototyping
• High-speed data acquisition systems
• Industrial automation controllers
• Custom carrier board development

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific assembly variant (82C36-A) against the required FPGA speed grade and package type. Confirm that the carrier board supports the recommended 3.0 to 5.5V input voltage range. Ensure compatibility with the provided B2B connectors (LSHM-150-04.0-L-DV-A-S-K-TR) for signal routing. Review the revision history for updates regarding component substitutions and I2C stability improvements.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a moderate number of general-purpose IOs and high-speed serial links are required within a compact form factor. Note that Bank 13 signals are not available on the 15T, 35T, or 50T variants of the same FPGA family; verify the exact device suffix matches the intended IO bank usage. Ensure the carrier design accommodates the specified power rail tolerances and thermal requirements for the 484-ball FBGA package.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0712 series of micromodules designed by Trenz Electronic GmbH. These modules serve as building blocks for custom SoM designs based on Xilinx Artix-7 devices. The specific model integrates standard peripheral interfaces like Ethernet and I2C alongside the core FPGA fabric, simplifying the transition from prototype to production environments.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify pinout and electrical specifications if considering alternative FPGA vendors or different speed grades within the same Artix-7 family.