TE0713-02-100-2C

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0713-02-100-2C is a System-on-Module (SoM) integrating the Xilinx Artix-7 XC7A100T-2FGG484C FPGA. It features 1 GByte of 32-bit DDR3L SDRAM and 32 MByte QSPI Flash memory with XiP support. The module includes a USB 3.0 to FIFO bridge, four GTP transceiver lanes, and programmable clock generators. It utilizes rugged high-speed hermaphroditic strips for connectivity and incorporates on-board DC-DC converters with system management capabilities.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Artix-7 XC7A100T-2FGG484C FPGA core
• 1 GByte DDR3L 32-bit SDRAM and 32 MByte QSPI Flash
• USB 3.0 to FIFO interface bridge
• Four GTP multi Gigabit transceiver lanes
• Programmable clock quad generator with default 125 MHz GTP and 200 MHz fabric clocks

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation systems requiring high shock and vibration resistance
• Embedded digital signal processing applications
• High-speed data acquisition modules
• Prototyping platforms utilizing USB 3.0 FIFO interfaces

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify component availability through authorized distributors as stock levels fluctuate. Confirm that the commercial temperature range (0°C to +70°C) aligns with project requirements, noting that industrial ranges are available upon request. Ensure carrier board compatibility with the 2 x 100-pin and 1 x 60-pin strip connectors before procurement.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a compact 4 x 5 cm form factor is required alongside significant logic resources from the Artix-7 family. The inclusion of integrated DDR3L and QSPI Flash reduces external component count compared to bare FPGA solutions. Consider the USB 3.0 bridge feature if direct host PC communication via FIFO protocols is necessary without additional interface controllers.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the Trenz Electronic TE0713 series, designed for the 4 x 5 cm standard footprint. It is mechanically and largely electrically compatible with other modules in this specific size category, facilitating design reuse across different processor cores within the same physical envelope.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements require matching the 4 x 5 cm footprint and connector pinout. Alternative SoMs from Trenz Electronic using different FPGAs may serve as functional substitutes if electrical compatibility with the carrier board is maintained.