Microcontrollers, Microprocessor, FPGA Modules TE0715-04-30-1I3 product image

TE0715-04-30-1I3

  • Description:IC MOD CORTEX-A9 125MHZ 1GB 32MB
  • Series:TE0715

SKU:bdd609393fdc Category: Brand:

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TE0715-04-30-1I3 is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC MOD CORTEX-A9 125MHZ 1GB 32MB. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for TE0715-04-30-1I3

  • Description:IC MOD CORTEX-A9 125MHZ 1GB 32MB
  • Series:TE0715
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7030)
  • Speed:125MHz
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for TE0715-04-30-1I3

TE0715-04-30-1I3

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0715-04-30-1I3 is a System on Module (SoM) manufactured by Trenz Electronic, built upon the AMD Zynq-7000 SoC architecture. This specific variant integrates an Artix-7 FPGA core with Quad GTP transceivers, DDR3 SDRAM memory, and Flash storage components. The module supports standard interfaces including Ethernet, JTAG, QSPI, and USB 2.0 connectivity. It is designed for embedded computing applications requiring high-performance processing within a compact form factor.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Integrates AMD Zynq-7000 SoC with Quad GTP transceivers for high-speed data transmission
  • Includes onboard DDR3 SDRAM and Flash memory for system operation and storage
  • Supports multiple communication interfaces including Ethernet, JTAG, QSPI, and USB 2.0

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Embedded industrial control systems
  • High-speed data acquisition modules
  • Custom FPGA-based prototyping platforms

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify component availability status prior to procurement as supply conditions may be restricted or limited. Confirm that the specific revision level matches project requirements, noting any relevant Product Change Notifications such as DDR3 updates associated with this module series. Ensure compatibility with carrier board designs before finalizing orders.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a complete SoM solution based on the Zynq-7000 architecture is required. Consider the integrated memory configuration and interface options against application bandwidth needs. Evaluate thermal management requirements for the specific operating environment. Verify that the physical dimensions and pinout align with the intended carrier board design constraints.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0715 family of System on Modules from Trenz Electronic. These modules are engineered to simplify the integration of Xilinx/AMD Zynq devices into custom hardware designs. The family provides pre-validated reference designs and documentation to accelerate development cycles for complex embedded applications requiring both programmable logic and processor cores.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Check for updated revisions within the TE0715 series. Consult official Product Change Notifications for potential component substitutions. No direct public substitute part numbers are confirmed in available documentation.

TE0715-04-30-1I3TE0715-04-30-1I3

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