TE0715-04-30-1IA

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-30-1IA is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically utilizing the XC7Z030 chip. It integrates a dual-core ARM Cortex-A9 processor with 1 GByte of 32-bit wide DDR3L SDRAM and 32 MBytes of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY and a Microchip USB3320 high-speed ULPI transceiver for USB 2.0 connectivity. Designed for rugged environments, it includes programmable clock generation, temperature-compensated RTC, and eFUSE/AES bit-stream encryption capabilities.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Industrial-grade Xilinx Zynq-7000 SoC (XC7Z030) with dual ARM Cortex-A9 processors
• 1 GByte DDR3L SDRAM and 32 MByte Quad SPI Flash memory
• Integrated Gigabit Ethernet PHY (Marvell 88E1512) and USB 2.0 ULPI PHY (Microchip USB3320)
• Four GTX/GTP high-performance transceiver lanes with dedicated clock inputs
• System management via Lattice MachXO2 CPLD, including eFUSE and AES encryption support

Microcontrollers, Microprocessor, FPGA Modules Applications

• High-speed data acquisition systems
• Embedded digital signal processing applications
• Industrial automation and process control
• Precision measurement systems

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify that the specific ordering suffix matches the required silicon variant (XC7Z030) and operating temperature range. Confirm carrier board compatibility regarding voltage levels, as the -30 variant utilizes High Performance banks restricted to 1.8V maximum I/O voltage. Ensure baseboard design accounts for the recommended 3A power supply capability during startup.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this model when the XC7Z030 logic density is required over the smaller XC7Z015 option. Note that the -30 designation indicates HP bank usage, limiting I/O voltages to 1.8V compared to the 3.3V tolerance of HR banks in the -15 variant. Verify if the pre-programmed demo design in the Quad SPI Flash meets initial testing requirements or if blank flash configuration is needed.

Microcontrollers, Microprocessor, FPGA Modules Part Context

The TE0715 series represents Trenz Electronic's 4x5 cm form factor modules designed for integration into custom carrier boards. This specific part belongs to the Zynq-7000 family, bridging programmable logic with embedded processing. It is often paired with Trenz Electronic baseboards such as the TEBA0714 or TEBB0714 for evaluation and development purposes.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

For higher performance needs within the same footprint, consider the TE0715-04-45-1IA which uses the XC7Z045 SoC. For lower cost or reduced resource requirements, the TE0715-04-15-1IA utilizes the XC7Z015 SoC but retains HR bank voltage tolerances.