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TE0715-04-30-3E is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC SOC MODULE 1GB DDR3L. Review the specifications below when checking this part for your BOM.
The Trenz Electronic TE0715-04-30-3E is an industrial-grade System-on-Module (SoM) based on the Xilinx Zynq XC7Z030-2FBG676I SoC. It integrates 1 GB of 32-bit wide DDR3L SDRAM and 32 MB of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY, a Microchip USB3320 ULPI transceiver for USB 2.0, and a Silicon Labs Si5338A programmable clock generator. Connectivity is provided via rugged Samtec Razor Beam high-speed stacking strips, exposing 132 FPGA I/Os, four GTP/GTX transceiver lanes, and PS MIO signals.
Verify that the carrier board design supports the specific voltage requirements of the TE0715-xx-30 variant, particularly for banks 34 and 35 which are High Performance (HP) banks limited to 1.8V maximum tolerance. Ensure stabilized internal voltages (3.3V or 1.8V) are present before powering up any FPGA I/O bank voltages to prevent damage. Confirm that the baseboard provides the necessary battery supply for the RTC function.
Select this module when the application requires the higher logic capacity of the XC7Z030 compared to the XC7Z015. Note that the -30 suffix indicates HP banks restricted to 1.8V I/O levels, unlike the -15 variant which supports up to 3.3V on these banks. Verify that the carrier board can accommodate the required power rails, including VIN, 3.3VIN, and specific VCCO levels for the selected I/O banks.
The TE0715 series comprises industrial-grade SoMs designed for harsh environments. This specific model utilizes the XC7Z030 processor, offering more programmable logic resources than the XC7Z015-based counterparts. The module is part of Trenz Electronic's 4x5 cm form factor lineup, providing a standardized footprint for integration into custom carrier boards while maintaining ruggedness against shock and vibration.
Publicly confirmed substitute part numbers are not available in the provided documentation. For legacy replacement, consider the TE0715-04-15-3E if the lower logic density of the XC7Z015 is acceptable and 3.3V compatibility on banks 34/35 is required. Alternatively, evaluate newer Trenz Electronic modules such as the TE0745 series for updated component availability.
By default, the module supports Quad SPI and SD Card boot modes. The active mode is controlled by the MODE input signal from the B2B JM1 connector: High or open state selects QSPI boot, while Low or ground selects SD Card boot.
A globally unique 48-bit node address compatible with EUI-48 specification is stored in the Microchip 24AA025E48 EEPROM (U19). This device is accessible via the I2C bus at slave address 0x50, with one block write-protected for the address and the other available for user data.
On the TE0715-xx-30 variant, banks 34 and 35 are configured as High Performance (HP) banks. Their maximum voltage tolerance is limited to 1.8V. This differs from the -15 variant, where these banks are High Range (HR) and support voltages from 1.2V to 3.3V.
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