Microcontrollers, Microprocessor, FPGA Modules TE0715-04-30-3E product image

TE0715-04-30-3E

  • Description:IC SOC MODULE 1GB DDR3L
  • Series:TE0715

SKU:f94d8eb71b1b Category: Brand:

ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

TE0715-04-30-3E is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC SOC MODULE 1GB DDR3L. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for TE0715-04-30-3E

  • Description:IC SOC MODULE 1GB DDR3L
  • Series:TE0715
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7030)
  • Speed:125MHz
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for TE0715-04-30-3E

TE0715-04-30-3E

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-30-3E is an industrial-grade System-on-Module (SoM) based on the Xilinx Zynq XC7Z030-2FBG676I SoC. It integrates 1 GB of 32-bit wide DDR3L SDRAM and 32 MB of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY, a Microchip USB3320 ULPI transceiver for USB 2.0, and a Silicon Labs Si5338A programmable clock generator. Connectivity is provided via rugged Samtec Razor Beam high-speed stacking strips, exposing 132 FPGA I/Os, four GTP/GTX transceiver lanes, and PS MIO signals.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Xilinx Zynq XC7Z030-2FBG676I SoC with dual ARM Cortex-A9 processors
  • 1 GB DDR3L SDRAM and 32 MB Quad SPI Flash memory
  • Marvell 88E1512 Gigabit Ethernet PHY with RGMII and SGMII support
  • Microchip USB3320 High-speed USB 2.0 ULPI PHY
  • Four GTP/GTX high-performance transceiver lanes with dedicated clock inputs

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Industrial automation and control systems requiring high vibration resistance
  • Embedded digital signal processing applications utilizing the programmable logic fabric
  • Network infrastructure devices leveraging the Gigabit Ethernet interface
  • Data acquisition systems using the high-speed transceivers

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify that the carrier board design supports the specific voltage requirements of the TE0715-xx-30 variant, particularly for banks 34 and 35 which are High Performance (HP) banks limited to 1.8V maximum tolerance. Ensure stabilized internal voltages (3.3V or 1.8V) are present before powering up any FPGA I/O bank voltages to prevent damage. Confirm that the baseboard provides the necessary battery supply for the RTC function.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when the application requires the higher logic capacity of the XC7Z030 compared to the XC7Z015. Note that the -30 suffix indicates HP banks restricted to 1.8V I/O levels, unlike the -15 variant which supports up to 3.3V on these banks. Verify that the carrier board can accommodate the required power rails, including VIN, 3.3VIN, and specific VCCO levels for the selected I/O banks.

Microcontrollers, Microprocessor, FPGA Modules Part Context

The TE0715 series comprises industrial-grade SoMs designed for harsh environments. This specific model utilizes the XC7Z030 processor, offering more programmable logic resources than the XC7Z015-based counterparts. The module is part of Trenz Electronic's 4x5 cm form factor lineup, providing a standardized footprint for integration into custom carrier boards while maintaining ruggedness against shock and vibration.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. For legacy replacement, consider the TE0715-04-15-3E if the lower logic density of the XC7Z015 is acceptable and 3.3V compatibility on banks 34/35 is required. Alternatively, evaluate newer Trenz Electronic modules such as the TE0745 series for updated component availability.

Microcontrollers, Microprocessor, FPGA Modules FAQ

What is the default boot mode for the TE0715-04-30-3E?

By default, the module supports Quad SPI and SD Card boot modes. The active mode is controlled by the MODE input signal from the B2B JM1 connector: High or open state selects QSPI boot, while Low or ground selects SD Card boot.

How is the MAC address stored on the module?

A globally unique 48-bit node address compatible with EUI-48 specification is stored in the Microchip 24AA025E48 EEPROM (U19). This device is accessible via the I2C bus at slave address 0x50, with one block write-protected for the address and the other available for user data.

What are the voltage constraints for banks 34 and 35 on this module?

On the TE0715-xx-30 variant, banks 34 and 35 are configured as High Performance (HP) banks. Their maximum voltage tolerance is limited to 1.8V. This differs from the -15 variant, where these banks are High Range (HR) and support voltages from 1.2V to 3.3V.

TE0715-04-30-3ETE0715-04-30-3E

Click on the inquiry