TE0715-04-51I33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-51I33-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z030 variant. It integrates 1 GByte of 32-bit wide DDR3L SDRAM and 32 MBytes of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY and a Microchip USB3320 high-speed ULPI transceiver for USB 2.0 connectivity. Powered by dual ARM Cortex-A9 processors, it provides rugged B2B connectors with 132 FPGA I/Os, 14 PS MIO pins, and four GTP/GTX high-performance transceiver lanes.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq-7000 SoC (XC7Z030) with dual ARM Cortex-A9 processors
• 1 GB DDR3L SDRAM and 32 MB Quad SPI Flash memory
• Marvell Alaska 88E1512 Gigabit Ethernet PHY and Microchip USB3320 ULPI PHY
• System Controller CPLD (Lattice MachXO2-256HC) for power management and monitoring

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring rugged performance
• Embedded vision and multimedia processing applications
• High-speed data acquisition and communication interfaces
• Medical equipment and instrumentation modules

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix to confirm the processor speed grade and package type. Ensure the carrier board design supports the required power-on sequence and voltage levels for the HP banks if using the -30 variant. Confirm that the baseboard provides the necessary battery supply for the RTC functionality.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when high-performance processing is needed alongside programmable logic. The -30 variant offers more HP banks but requires strict adherence to 1.8V limits for those specific banks. Verify that the carrier board can accommodate the Samtec Razor Beam connectors and provides adequate cooling for the DC-DC converters under maximum load conditions.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the TE0715 family from Trenz Electronic, designed for Xilinx Zynq-7000 devices. It serves as a compact, industrial-grade building block for complex embedded designs. The -04-51I33-A designation indicates the specific configuration including the XC7Z030 processor, memory size, and temperature range specifications defined in the technical reference manual.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements are limited within the same product line. Consider the TE0715-04-51I13-A if the lower-performance XC7Z015 SoC is sufficient for the application requirements. Both variants share the same mechanical footprint and peripheral layout, ensuring pin compatibility on the carrier board.

Microcontrollers, Microprocessor, FPGA Modules FAQ

What is the default boot mode for the TE0715 module?

The default boot mode is Quad SPI, controlled by the MODE input signal on the B2B connector. A High or open state selects QSPI boot, while Low or ground selects SD Card boot.

How is the MAC address stored on the module?

A globally unique 48-bit node address compatible with EUI-48 specification is stored in the Microchip 24AA025E48 EEPROM at I2C slave address 0x50.

What are the voltage constraints for Bank 34 on the TE0715-xx-30 variant?

On the TE0715-xx-30 modules, Bank 34 consists of High Performance (HP) banks with a maximum voltage tolerance of 1.8V, unlike the HR banks on the -15 variant which support up to 3.3V.