TE0715-04-71C33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-71C33-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically utilizing the XC7Z030 variant. It integrates a dual-core ARM Cortex-A9 processor with 1 GB of 32-bit wide DDR3L SDRAM and 32 MB of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY and a Microchip USB3320 high-speed ULPI transceiver. Connectivity is provided via rugged Samtec Razor Beam connectors offering 132 FPGA I/Os and four GTP/GTX transceiver lanes. On-board power management includes high-efficiency DC-DC converters supporting specific current rails for system operation.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq-7000 SoC (XC7Z030) with dual ARM Cortex-A9 cores
• 1 GB DDR3L SDRAM and 32 MB Quad SPI Flash memory
• Marvell 88E1512 Gigabit Ethernet PHY and Microchip USB3320 ULPI PHY
• Four GTX transceiver lanes with programmable clock generator (Si5338A)
• Industrial-grade design with eFUSE bit-stream encryption and AES support

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring programmable logic
• Embedded computing platforms needing high-speed serial communication interfaces
• Network infrastructure equipment utilizing Gigabit Ethernet connectivity
• Data acquisition systems integrating real-time processing with FPGA flexibility

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and hardware revision. Ensure carrier board designs account for the 1.8V voltage tolerance limits on HP banks associated with the XC7Z030 variant. Confirm that the required boot mode configuration matches the intended deployment environment.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when high-performance processing combined with significant FPGA fabric resources is required. The XC7Z030 provides more logic cells than the XC7Z015 variant. Verify baseboard compatibility regarding the 1.8V maximum voltage constraint on banks 34 and 35. Ensure sufficient thermal management is planned due to the power consumption characteristics of the Zynq-7000 series under load.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0715 family of System on Modules from Trenz Electronic. The family supports both XC7Z015 and XC7Z030 processors. The TE0715-04-71C33-A designation indicates the specific processor speed grade and package configuration within the standard 4x5 cm form factor. It shares common peripheral architectures with other variants in the series, differing primarily in internal resource counts.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct pin-compatible replacements within the same form factor are limited to other TE0715 variants using different Zynq speed grades. Cross-family migration to newer Xilinx architectures requires complete redesign of the carrier board and firmware. No equivalent single-chip solutions exist that match the integrated FPGA/ARM architecture and peripheral density.