TE0715-04-71I33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-71I33-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z030 variant. It integrates 1 GB of 32-bit wide DDR3L SDRAM and 32 MB of Quad SPI Flash memory. The module features a Marvell Alaska 88E1512 Gigabit Ethernet PHY and a Microchip USB3320 high-speed ULPI transceiver. Power management includes high-efficiency DC-DC converters providing dedicated rails for the processor core and I/O banks. The design utilizes rugged Samtec Razor Beam connectors to expose 132 FPGA I/Os and four GTP/GTX transceiver lanes.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq-7000 XC7Z030 SoC with dual ARM Cortex-A9 processors
• 1 GB DDR3L SDRAM and 32 MB Quad SPI Flash memory
• Marvell 88E1512 Gigabit Ethernet PHY with RGMII and SGMII support
• Microchip USB3320 ULPI PHY supporting USB 2.0 High-Speed

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation controllers requiring robust processing
• Embedded vision systems utilizing FPGA programmable logic
• Network infrastructure equipment with Gigabit connectivity
• Portable medical devices needing compact form factors

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability status. Ensure the carrier board design supports the required power-on sequence and voltage levels for the HP banks if using the -30 variant. Confirm that the baseboard provides the necessary battery input for the RTC functionality.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a Zynq-7000 solution with integrated peripherals is required. The -30 suffix indicates the XC7Z030 chip, which offers higher performance than the -15 variant. Verify that the carrier board can supply the recommended 3A minimum current during startup. Check bank voltage compatibility, as HP banks on the -30 model are limited to 1.8V maximum.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0715 family from Trenz Electronic, designed for the 4x5 cm standard footprint. It serves as a drop-in replacement for other modules in the series that share the same connector layout but differ in the underlying Xilinx SoC or memory configuration.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements within the TE0715 family include the TE0715-04-71I15-A, which uses the lower-performance XC7Z015 SoC. Cross-family substitution requires careful evaluation of pin compatibility and software driver support between different Zynq-7000 device families.

Microcontrollers, Microprocessor, FPGA Modules FAQ

What determines the boot mode on the TE0715?

Boot mode is controlled by the MODE signal on the B2B JM1 connector. A High or open state selects Quad SPI boot, while a Low or grounded state selects SD Card boot.

How is the MAC address stored on this module?

The module uses a Microchip 24AA025E48 EEPROM containing a globally unique 48-bit node address compatible with EUI-48 specification, accessible via the I2C bus at slave address 0x50.

What is the maximum voltage tolerance for HP banks on the -30 variant?

For the TE0715-xx-30 modules, banks 34 and 35 are configured as High Performance (HP) banks with a maximum voltage tolerance of 1.8V.