TE0715-04-73E33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0715-04-73E33-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically utilizing the XC7Z030 variant. It integrates a dual-core ARM Cortex-A9 processor with 1GB of 32-bit wide DDR3L SDRAM and 32MB of Quad SPI Flash memory. The module features rugged high-speed stacking strips providing 132 FPGA I/Os and four GTP/GTX transceiver lanes. Onboard peripherals include a Marvell Alaska 88E1512 Gigabit Ethernet PHY, a Microchip USB3320 ULPI PHY, a temperature-compensated RTC, and a Lattice MachXO2 CPLD for system management.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Industrial-grade Xilinx Zynq-7000 SoC (XC7Z030) with dual ARM Cortex-A9 cores
• 1GB DDR3L SDRAM and 32MB Quad SPI Flash memory
• Marvell Alaska 88E1512 Gigabit Ethernet PHY and Microchip USB3320 ULPI PHY
• System Controller CPLD (Lattice MachXO2-256HC) for power management and reset generation

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring programmable logic
• Embedded computing platforms needing high-speed serial connectivity via GTX lanes
• Networked edge devices utilizing integrated Gigabit Ethernet and USB interfaces

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify that the specific ordering suffix corresponds to the required performance grade and package configuration. Confirm carrier board compatibility regarding voltage levels, particularly for HP banks on the -xx-30 variants which are limited to 1.8V. Ensure the baseboard design supports the recommended power-on sequence and provides stable voltages before powering FPGA I/O banks.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a Zynq-7000 SoC with higher processing capacity than the XC7Z015 is required. The -xx-30 variant utilizes High Performance (HP) banks restricted to 1.8V maximum voltage, unlike the High Range (HR) banks on the -xx-15 variant. Verify that the carrier board can supply the necessary current for the 1.0V, 1.5V, and 1.8V rails during startup.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the Trenz Electronic TE0715 family, designed as a compact, ruggedized compute core for Xilinx Zynq-7000 applications. It serves as a drop-in replacement for other TE0715 variants within the same form factor, provided the baseboard accommodates the specific SoC capabilities and I/O voltage constraints of the XC7Z030 chip.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct functional replacements within the TE0715 family include the TE0715-04-73E15-A, which uses the lower-capacity XC7Z015 SoC but maintains identical mechanical and peripheral configurations. Cross-family substitution requires careful evaluation of pin compatibility and software migration efforts.