TE0715-05-52I33-A

$356.15

Description：SOC MODULE WITH XILINX ZYNQ XC7Z
Series：TE0711

SKU:cc651c1e3862 Category: Microcontrollers, Microprocessor, FPGA Modules Brand: Trenz Electronic GmbH

Consult the customer manager about the wholesale price.

consultation hotline：86-132-6715-2157

email：[email protected]
Contact the product manager for consultation. One-stop consultation is available.

Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Product introduction

TE0715-05-52I33-A is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is SOC MODULE WITH XILINX ZYNQ XC7Z. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for TE0715-05-52I33-A

Description：SOC MODULE WITH XILINX ZYNQ XC7Z
Series：TE0711
Mfr：Trenz Electronic GmbH
Package：Bulk
Module/Board Type：MPU Core
Core Processor：Zynq™ 7015 XC7Z015-2CLG485I
Co-Processor：ARM Cortex-A9
Speed：-
Flash Size：32MB
RAM Size：1GB
Connector Type：Board-to-Board (BTB) Socket
Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
Operating Temperature：-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for TE0715-05-52I33-A

TE0715-05-52I33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0715-05-52I33-A is a System on Module (SoM) manufactured by Trenz Electronic GmbH, designed for programmable logic applications. It integrates the AMD Zynq XC7Z045-2FBG676I processor, featuring dual ARM Cortex-A9 cores and FPGA fabric. The module includes 1 GB of DDR3L RAM and utilizes a 52 mm x 76 mm form factor. It supports operating temperatures from -40°C to +85°C and provides interfaces including Ethernet, I2C, QSPI, and USB 2.0 OTG.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

Integrates AMD Zynq-7000 SoC with quad GTP transceivers for high-speed data transmission
Combines programmable logic fabric with dual-core ARM Cortex-A9 processors
Includes integrated DDR3L memory and flash storage within a compact module design

Microcontrollers, Microprocessor, FPGA Modules Applications

Industrial automation control systems
Embedded computing platforms requiring mixed signal processing
Communication infrastructure equipment

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix to ensure compatibility with required temperature ranges and memory configurations. Confirm that the baseboard design supports the Board-to-Board socket interface specifications. Check for updated datasheets regarding pinout definitions and power sequencing requirements before integration into final hardware designs.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a combined FPGA and processor solution is required in a small footprint. Consider the thermal performance limits of the -40°C to +85°C range for your environment. Ensure the application can utilize the available GPIO and serial interfaces provided by the Zynq architecture.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the Trenz Electronic TE0715 family of System on Modules. These modules are engineered to accelerate development cycles by providing a pre-validated platform based on AMD Zynq technology. They serve as core processing units for various embedded solutions.