Microcontrollers, Microprocessor, FPGA Modules TE0720-03-1CFA product image

TE0720-03-1CFA

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0720

SKU:1de570137147 Category: Brand:

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TE0720-03-1CFA is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC MODULE CORTEX-A9 1GB 32MB. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for TE0720-03-1CFA

  • Description:IC MODULE CORTEX-A9 1GB 32MB
  • Series:TE0720
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7020)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:1GB
  • Connector Type:Samtec LSHM
  • Size / Dimension:1.970" L x 1.570" W (50.00mm x 40.00mm)
  • Operating Temperature:0°C ~ 70°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for TE0720-03-1CFA

TE0720-03-1CFA

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0720-03-1CFA is a System-on-Module (SOM) integrating the Xilinx Zynq XC7Z020-1CLG484C processor. It features a dual-core ARM Cortex-A9 MPCore and programmable logic with 152 FPGA I/Os. Memory includes 1 GByte of 32-bit DDR3 SDRAM, 32 MByte QSPI Flash for configuration, and 8 GByte e.MMC storage. Connectivity comprises a tri-speed Gigabit Ethernet transceiver and USB 2.0 high-speed ULPI. The module utilizes rugged high-speed stacking strips for interface expansion and operates within a commercial temperature range of 0°C to +70°C.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Xilinx Zynq XC7Z020-1CLG484C SoC with ARM Cortex-A9 and FPGA fabric
  • 1 GByte DDR3 SDRAM and 8 GByte e.MMC storage
  • Tri-speed Gigabit Ethernet and USB 2.0 ULPI transceivers
  • eFUSE and AES bit-stream encryption capabilities

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Industrial embedded systems requiring secure boot
  • Network infrastructure devices utilizing Gigabit Ethernet
  • Portable computing platforms leveraging e.MMC storage

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm current availability status as supply conditions may vary. Ensure compatibility with carrier board designs regarding the 4 x 5 cm form factor and mechanical mounting requirements.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when specific integration of Zynq XC7Z020 processing power with 1 GByte DDR3 and 8 GByte e.MMC is required. Consider thermal management solutions as operating temperature depends on customer design. Evaluate the need for industrial temperature variants if operation outside 0°C to +70°C is necessary.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the Trenz Electronic TE0720 series, designed for compact embedded applications. It shares mechanical compatibility with other modules in the 4 x 5 cm footprint family, allowing for potential migration between different processor configurations within the same product line while maintaining standard interface connections.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Users should consult Trenz Electronic directly for alternative modules within the TE0720 series that match specific performance or memory requirements.

TE0720-03-1CFATE0720-03-1CFA

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