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TE0720-03-2IFA is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is IC SOC MODULE XILINX ZYNQ. Review the specifications below when checking this part for your BOM.
The Trenz Electronic TE0720-03-2IFA is an industrial-grade System-on-Module (SoM) based on the Xilinx Zynq XC7Z020 SoC. It features a dual-core ARM Cortex-A9 MPCore processing system and an Artix-7 FPGA with 85K logic cells. The module includes up to 1 GB of DDR3/L SDRAM, 32 MB of Quad SPI Flash, and supports eMMC storage. Integrated peripherals include a Marvell 88E1512 Gigabit Ethernet PHY, Microchip USB3320C ULPI transceiver, Lattice LCMXO2-1200HC CPLD, and optional LSM303D eCompass. It utilizes rugged Samtec Razor Beam connectors for board-to-board interfacing.
Verify component availability as stock status may be restricted or limited. Confirm specific assembly options such as eMMC capacity and eCompass inclusion, as these vary by variant. Ensure carrier board design adheres to the recommended power sequencing and voltage requirements specified in the technical reference manual.
Select this module for applications requiring high-performance mixed-signal processing with integrated connectivity. The XC7Z020 provides significant programmable logic resources compared to lower-tier variants. Verify that the carrier board supports the required 3.3V power input and interfaces with the Samtec B2B connectors. Consider the optional eCompass and crypto-authentication features if security or motion sensing is required.
The TE0720 series comprises various SoM variants based on Xilinx Zynq-7000 devices. The TE0720-03-2IFA specifically utilizes the higher-performance XC7Z020 chip. Other variants in the family may use the single-core XC7Z014S or different memory configurations. The module is part of Trenz Electronic's 4x5 cm form factor product line designed for industrial environments.
No direct public substitute part numbers are confirmed. Alternative solutions would require redesigning the carrier board due to the specific B2B connector footprint and pinout. Evaluate other Trenz Electronic TE0720 variants or competing Zynq-based SoMs from different manufacturers if form factor constraints allow.
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