TE0720-03-61C33FA

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0720-03-61C33FA is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z020. It integrates a dual-core ARM Cortex-A9 MPCore processing system and an Artix-7 FPGA with 85K programmable logic cells. The module includes up to 1 GB of DDR3/L SDRAM, 32 MB Quad SPI Flash, and an eMMC NAND Flash interface. Onboard peripherals feature a Marvell 88E1512 Gigabit Ethernet PHY, Microchip USB3320C ULPI transceiver, Lattice LCMXO2-1200HC CPLD, and an Intersil ISL12020M RTC. Connectivity is provided via three Samtec Razor Beam connectors.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq XC7Z020 SoC with dual-core ARM Cortex-A9 and 85K Artix-7 PL cells
• Up to 1 GB DDR3/L SDRAM and 32 MB Quad SPI Flash memory
• Integrated Marvell 88E1512 Gigabit Ethernet PHY and Microchip USB3320C ULPI PHY
• System Controller CPLD (Lattice LCMXO2-1200HC) for power management and peripheral control

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems requiring rugged hardware
• Embedded vision and signal processing applications utilizing the Artix-7 FPGA
• Networked edge devices with Gigabit Ethernet connectivity
• Secure embedded systems leveraging Atmel ATSHA204A authentication

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific memory configuration and eMMC capacity associated with the -61C33FA suffix against the manufacturer's current production variants table. Confirm that the required operating temperature range aligns with the industrial grade specifications defined in the technical manual. Ensure carrier board designs account for the recommended 3.3V power input and proper I/O tri-stating during power-up sequences.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a combination of high-performance ARM processing and flexible FPGA logic is required in a compact form factor. The TE0720-03 variant provides extensive I/O through Samtec connectors, suitable for complex carrier board designs. Consider the integrated security features like the MAC address EEPROM and CryptoAuthentication chip if data integrity and device identity are critical requirements.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the TE0720 family of System on Modules from Trenz Electronic. These modules are designed around the Xilinx Zynq-7000 series, offering varying levels of PS and PL resources. The TE0720-03 designation typically refers to a specific pinout or connector configuration within the 4x5 module standard, differing from other variants like the TE0720-01 or TE0720-02 which may have different I/O mappings or component selections.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct replacements are limited due to the proprietary integration of Trenz Electronic's CPLD firmware and specific B2B connector layouts. Alternative solutions would require redesigning the carrier board to accommodate different pinouts and power sequencing. Evaluate other Zynq-based SOMs from vendors like Avnet or Trenz Electronic's own TE0720-01/02 variants if pin compatibility is not strictly required.