TE0720-03-62I330M

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0720-03-62I330M is a System-on-Module (SOM) manufactured by Trenz Electronic, based on the AMD Xilinx Zynq-7000 family. It integrates the XC7Z020-2CLG400I processor, featuring dual ARM Cortex-A9 cores and programmable logic resources. The module includes 1 GB of DDR3 SDRAM and 32 GB of e.MMC storage. Key interfaces supported include Ethernet, JTAG, QSPI, and USB 2.0. Designed for industrial applications, it operates within a temperature range of -40°C to +85°C and measures 40 mm x 50 mm.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Processor: AMD Xilinx Zynq-7020 SoC with dual-core ARM Cortex-A9
• Memory: 1 GB DDR3 SDRAM and 32 GB e.MMC flash storage
• Interfaces: Integrated Ethernet, JTAG, QSPI, and USB 2.0 controllers
• Form Factor: Compact 40 mm x 50 mm modular system design

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems
• Embedded computing platforms requiring FPGA flexibility
• Data acquisition and signal processing modules
• Automotive infotainment and instrument clusters

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

This component is listed as obsolete or end-of-life by the manufacturer. Availability is restricted, and sourcing may require checking secondary distributors or existing stock. Verify RoHS compliance details and specific revision levels through official documentation before procurement planning.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a compact SOM solution with integrated Zynq-7000 processing is required. Ensure the baseboard design supports the 40x50mm footprint and provides necessary power rails (3.3V to 5.5V input). Compare against newer Zynq UltraScale+ MPSoC modules if higher performance or advanced interfaces are needed.

Microcontrollers, Microprocessor, FPGA Modules Part Context

The TE0720 series represents Trenz Electronic's standard 4x5 cm SOM line utilizing Xilinx Zynq-7000 devices. This specific part number denotes a configuration with 1GB RAM and 32GB eMMC. It is part of a broader ecosystem including carrier boards like the TEF0007 and development kits for motor control and Simulink integration.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

As an obsolete part, direct replacements may not exist in identical form factors. Consider the TE0720-03-62I33GA or TE0724-03-20-1I for similar Zynq-7000 specifications. For upgraded performance, evaluate the TE0820 series based on Zynq UltraScale+ MPSoC architecture.