TE0720-03-62I33MA

Microcontrollers, Microprocessor, FPGA Modules Overview

The Trenz Electronic TE0720-03-62I33MA is an industrial-grade System-on-Module (SoM) based on the Xilinx Zynq-7000 SoC, specifically the XC7Z020. It integrates a dual-core ARM Cortex-A9 MPCore processing system and an Artix-7 FPGA with 85K programmable logic cells. The module includes up to 1 GB of DDR3/L SDRAM, 32 MB of Quad SPI flash memory, and supports eMMC storage up to 32 GB. Key peripherals include a Marvell 88E1512 Gigabit Ethernet PHY, Microchip USB3320C ULPI transceiver, Lattice CPLD for system control, and optional sensors like the LSM303D eCompass.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Xilinx Zynq XC7Z020 SoC with dual-core ARM Cortex-A9 and 85K Artix-7 PL cells
• Up to 1 GB DDR3/L SDRAM and 32 MB QSPI Flash
• Integrated Gigabit Ethernet (Marvell 88E1512) and High-speed USB 2.0 (Microchip USB3320C)
• System Controller CPLD (Lattice LCMXO2-1200HC) for power management and peripheral control

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation and control systems
• Embedded computing platforms requiring high I/O flexibility
• Ruggedized applications with shock and vibration resistance requirements

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against the manufacturer's current production list to confirm availability and exact component configuration. Check for any Product Change Notifications (PCNs) that may affect pin compatibility or firmware defaults. Ensure carrier board designs account for the recommended 3A startup current and proper power sequencing via the NOSEQ signal.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this variant if the application requires the higher performance of the XC7Z020 over the single-core XC7Z014S. Confirm that the required eMMC capacity (up to 32 GB) is available in the specific sub-variant. Verify that the carrier board supports the 3 x Samtec LSHM series connectors and provides the necessary 3.3V power input rails for both VIN and 3.3VIN.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This module belongs to the TE0720 family from Trenz Electronic, designed for the Xilinx Zynq-7000 series. It utilizes a standardized 4x5 cm form factor with rugged stacking strip connectors. The family shares common mechanical dimensions and basic interface layouts, but specific memory capacities, processor cores, and optional peripherals vary by ordering suffix.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

No direct public substitute part numbers are documented. Alternative solutions would require evaluating other Zynq-7000 based SOMs from different manufacturers, noting differences in connector types, memory configurations, and CPLD integration.