Microcontrollers, Microprocessor, FPGA Modules TE0724-04-61I33-A product image

TE0724-04-61I33-A

  • Description:SOC MODULE WITH XILINX ZYNQ XC7Z
  • Series:Zynq™

SKU:89033a0c0762 Category: Brand:

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TE0724-04-61I33-A is listed in the Microcontrollers, Microprocessor, FPGA Modules range at ChipApex. The manufacturer field lists Trenz Electronic GmbH. Its product description is SOC MODULE WITH XILINX ZYNQ XC7Z. Review the specifications below when checking this part for your BOM.

Microcontrollers, Microprocessor, FPGA Modules specifications for TE0724-04-61I33-A

  • Description:SOC MODULE WITH XILINX ZYNQ XC7Z
  • Series:Zynq™
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MPU Core
  • Core Processor:ARM® Cortex®-A9
  • Co-Processor:Zynq™ XC7Z020-1CLG400I
  • Speed:667MHz
  • Flash Size:64MB
  • RAM Size:1GB
  • Connector Type:1 x 160 Pin
  • Size / Dimension:2.362" L x 1.575" W (60.00mm x 40.00mm)
  • Operating Temperature:-40°C ~ 85°C

Microcontrollers, Microprocessor, FPGA Modules datasheet and documents for TE0724-04-61I33-A

TE0724-04-61I33-A

Microcontrollers, Microprocessor, FPGA Modules Overview

The TE0724-04-61I33-A is a System-On-Module (SOM) manufactured by Trenz Electronic GmbH, designed for industrial applications. It integrates an AMD Zynq XC7Z020-1CLG400I processor featuring dual-core ARM Cortex-A9 and programmable logic. The module includes 1 GByte of DDR3L memory and 64 MByte of flash storage. It operates within a temperature range of -40°C to +85°C and supports interfaces including CAN, I2C, and SPI. The physical dimensions are 60 mm x 40 mm.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

  • Integrates Xilinx Zynq SoC with dual-core ARM Cortex-A9 and FPGA fabric
  • Industrial-grade thermal rating suitable for harsh environments
  • Includes onboard DDR3L RAM and non-volatile flash memory
  • Supports standard communication protocols such as CAN, I2C, and SPI

Microcontrollers, Microprocessor, FPGA Modules Applications

  • Industrial automation control systems
  • Embedded computing in automotive electronics
  • IoT gateway devices requiring reliable connectivity
  • Medical equipment with strict environmental standards

Microcontrollers, Microprocessor, FPGA Modules Procurement Notes

Verify the specific ordering suffix against official Trenz Electronic documentation to ensure correct memory configuration and interface availability. Confirm current supply status as distribution channels may vary. Request updated datasheets to validate pinout compatibility with existing carrier board designs before finalizing procurement orders.

Microcontrollers, Microprocessor, FPGA Modules Selection Notes

Select this module when a compact industrial solution combining processing power and programmability is required. Ensure the target application fits within the 60 mm x 40 mm footprint constraints. Verify that the integrated 1 GB DDR3L and 64 MB flash meet the software storage requirements. Check that the supported operating voltage and temperature range align with the system's operational environment.

Microcontrollers, Microprocessor, FPGA Modules Part Context

This component belongs to the TE0724 family of System-On-Modules from Trenz Electronic. These modules are engineered around Xilinx Zynq processors to provide a complete embedded computing solution. The series is characterized by its industrial temperature ratings and robust design for long-term deployment in demanding sectors.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

TE0724-04-61I32-A

TE0724-04-61I33-ATE0724-04-61I33-A

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