TE0726-03-41C64-A

Overview

The Trenz Electronic TE0726-03-41C64-A is an industrial-grade System on Module (SoM) based on the Xilinx Zynq XC7Z010 SoC. It features a Raspberry Pi Model 2 form factor with dimensions of 40 mm x 30 mm. The module includes 512 MByte DDR3L SDRAM, 16 MByte SPI Flash memory, and a LAN9514 controller providing four USB 2.0 ports and 10/100 Mbit Ethernet. Connectivity options include HDMI, MIPI DSI for displays, CSI-2 for cameras, and a 26-pin GPIO header.

Feature Summary

• Xilinx Zynq XC7Z010-1CLG225C SoC with 512 MByte DDR3L SDRAM
• LAN9514 integrated USB hub and 10/100 Ethernet controller
• MIPI DSI display interface and CSI-2 camera connector
• FT2232H USB-to-UART/JTAG bridge with pre-programmed Xilinx license

Applications

• Industrial automation controllers
• Embedded vision systems utilizing CSI-2 cameras
• Portable devices requiring HDMI video output
• Networked IoT gateways with Ethernet connectivity

Procurement Notes

Verify that the specific ordering suffix corresponds to the required RAM capacity and temperature grade. Ensure the system controller CPLD firmware is updated if necessary for new hardware revisions. Confirm compatibility with existing carrier boards designed for the Raspberry Pi Model 2 footprint before integration.

Selection Notes

Select this model for applications requiring a compact FPGA SoM with standard peripheral interfaces. The TE0726-03 variant specifically provides 512 MByte of RAM, distinguishing it from lower-capacity versions. Consider the operating temperature range of 0°C to 70°C for environmental suitability.

Part Context

This module belongs to the TE0726 ZynqBerry series, which adapts Xilinx Zynq All Programmable SoCs into a standardized Raspberry Pi-compatible form factor. The TE0726-03 revision utilizes the XC7Z010 processor, offering a balance of processing power and I/O availability for embedded development.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Alternative modules within the same family may offer different RAM sizes or processor variants but require carrier board design adjustments.