TE0729-02-2IF

TE0729-02-2IF

  • Description:IC MODULE CORTEX-A9 512MB
  • Series:TE0729

SKU:6472cabd791c Category: Brand:

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Product Detailed Parameters

  • Description:IC MODULE CORTEX-A9 512MB
  • Series:TE0729
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7020)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:512MB
  • Connector Type:Samtec BTE
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0729-02-2IF

Overview

The TE0729-02-2IF is a System-on-Module (SOM) manufactured by Trenz Electronic GmbH, designed for embedded applications requiring high processing performance. It integrates the Xilinx Zynq-7000 SoC, specifically the Z-7020 variant, which combines dual-core ARM Cortex-A9 processors with programmable logic fabric. The module provides 512 MByte of DDR3 SDRAM and 32 MByte of flash memory for data storage and boot operations. Connectivity features include three Ethernet interfaces, supporting robust network integration in industrial and commercial environments.

Feature Summary

  • Integrates Xilinx Zynq-7000 SoC with dual-core ARM Cortex-A9 processors and FPGA fabric
  • Includes 512 MByte DDR3 SDRAM and 32 MByte flash memory
  • Provides three Ethernet interfaces for network connectivity

Applications

  • Industrial automation control systems
  • Embedded networking equipment
  • Medical device instrumentation
  • Automotive infotainment systems

Procurement Notes

Verify the specific revision suffix to ensure compatibility with your carrier board design. Confirm that the integrated Zynq-7020 device grade matches your environmental requirements. Check for any recent Product Change Notifications from Trenz Electronic regarding component substitutions or firmware updates. Ensure your power supply design meets the voltage and current specifications defined in the official datasheet.

Selection Notes

Select this module when a combined processor and FPGA solution is required within a compact form factor. It is suitable for designs needing multiple Ethernet ports without external controllers. Consider the thermal dissipation capabilities of your enclosure, as the Zynq-7020 generates significant heat under load. Evaluate if the 512 MB memory limit suffices for your application's real-time operating system and data buffering needs.

Part Context

This module belongs to the TE0729 family of System-on-Modules from Trenz Electronic. These modules are engineered to simplify the integration of Xilinx Zynq devices into custom hardware. The TE0729 series typically offers various memory configurations and interface options. This specific model focuses on providing balanced performance with standard connectivity options for general-purpose embedded computing tasks.

Replacement Considerations

Direct replacements may include other Trenz Electronic modules based on the same Zynq-7020 chip but with different memory sizes or interface counts. Cross-vendor alternatives would require significant redesign due to the proprietary nature of the SOM form factor and pinout. Verify mechanical dimensions and mounting hole patterns before considering any substitute components.

TE0729-02-2IFTE0729-02-2IF

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