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— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Trenz Electronic TE0729-02-62I63FAK is an industrial-grade System on Module (SoM) built around the Xilinx Zynq-7000 XC7Z020 SoC. It features a dual-core ARM Cortex-A9 MPCore and 136 FPGA I/Os, including 58 LVDS pairs. Memory includes 512 MB DDR3 SDRAM, 32 MB QSPI Flash, and 4 GB eMMC. Connectivity comprises one Gigabit Ethernet PHY and two 10/100 Mbps Ethernet PHYs, plus USB 2.0 OTG via ULPI. The module operates within a -40°C to +85°C temperature range and utilizes two 120-pin board-to-board connectors.
Verify that the specific suffix matches the required hardware revision and component configuration. Confirm the operating temperature grade aligns with environmental requirements. Check for any assembly options requested during ordering, as standard delivery may not include all variants. Ensure baseboard connectors match the specified REF-189019-01 type for proper mating height and signal integrity.
Select this module when an industrial temperature range (-40°C to +85°C) is mandatory. Choose based on the need for three distinct MAC addresses provided by onboard EEPROMs. Consider the power supply requirements, noting a minimum of 3A current capability is recommended for startup. Verify that the 5 mm stacking height and 76x52 mm dimensions fit the mechanical constraints of the target enclosure.
This part belongs to the TE0729 family of System on Modules from Trenz Electronic. It is specifically designed for applications requiring the processing power of the Zynq-7000 series in harsh environments. The module integrates essential peripherals like RTC, watchdog, and multiple Ethernet controllers directly onto the PCB to reduce baseboard complexity.
Publicly confirmed substitute part numbers are not available in the provided documentation. Users must evaluate alternative SoMs based on pin compatibility, memory capacity, and thermal specifications if direct replacement is necessary.