TE0729-02-62I63FAK

Overview

The TE0729-02-62I63FAK is an industrial-grade System-on-Module (SoM) manufactured by Trenz Electronic, built around the Xilinx Zynq-7000 XC7Z020 SoC. It features a dual-core ARM Cortex-A9 MPCore processor and 136 FPGA I/Os. The module includes 512 MB of 16-bit DDR3 SDRAM, 32 MB QSPI Flash, and 4 GB eMMC storage. Connectivity options consist of one Gigabit Ethernet PHY and two 10/100 Mbps Ethernet PHYs, alongside a USB 2.0 ULPI transceiver with OTG support. Power delivery utilizes on-board DC-DC converters for 1.0V, 1.5V, 1.8V, and 2.5V rails, accepting a VIN range of 2.5V to 3.6V.

Feature Summary

• Industrial-grade Xilinx Zynq-7000 XC7Z020 SoC with dual-core ARM Cortex-A9
• Integrated memory: 512 MB DDR3 SDRAM, 32 MB QSPI Flash, and 4 GB eMMC
• Triple Ethernet configuration: 1x GbE (Marvell 88E1512) and 2x 10/100 Mbps (Microchip KSZ8081)
• USB 2.0 ULPI transceiver supporting full OTG functionality

Applications

• Industrial automation controllers requiring rugged environmental tolerance
• Embedded vision systems utilizing the programmable logic fabric
• Network infrastructure devices leveraging triple Ethernet interfaces
• Portable instrumentation powered by single-rail 3.3V to 5.5V inputs

Procurement Notes

Verify component availability status prior to design finalization, as this specific part number may be subject to discontinuation or end-of-life notifications. Confirm that the required hardware revision matches the target application's compatibility requirements. Ensure baseboard designs accommodate the specified 120-pin double-row B2B connector interface and stacking height constraints.

Selection Notes

Select this module when an industrial temperature range (-40°C to +85°C) is mandatory for the deployment environment. Verify that the baseboard power supply can deliver a minimum of 3A to support the recommended startup current. Ensure the carrier board provides the necessary battery voltage input for the RTC backup functionality and adheres to the 3.3V I/O level restrictions for safe operation.

Part Context

This module belongs to the Trenz Electronic TE0729 family of System-on-Modules. It is designed to plug into custom carrier boards via two 120-pin connectors. The '02' in the model number indicates hardware revision 02. The suffix 'I63' typically denotes the industrial temperature grade and specific internal component variations defined by the manufacturer.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Designers should consult Trenz Electronic directly for alternative modules within the TE0729 series or other compatible SoM families if this specific SKU is unavailable.

FAQ

What are the supported boot modes for the TE0729?

The module supports primary boot from JTAG, SPI Flash, or SD Card. Secondary boot from on-board eMMC is also supported, provided the FSBL is loaded from SPI Flash first.

How many MAC addresses are supported on this module?

The TE0729 includes three Microchip 24AA025E48 EEPROMs containing globally unique EUI-48 compatible 48-bit node addresses, supporting up to three distinct MAC addresses.

What is the recommended input voltage range for the module?

The recommended operating condition for the VIN supply voltage is between 2.5V and 3.6V, although absolute maximum ratings allow up to 3.75V.