TE0729-02-62I63MA

TE0729-02-62I63MA

  • Description:IC SOC MODULE ZYNQ
  • Series:TE0729

SKU:538bb06e8f8a Category: Brand:

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Product Detailed Parameters

  • Description:IC SOC MODULE ZYNQ
  • Series:TE0729
  • Mfr:Trenz Electronic GmbH
  • Package:Bulk
  • Module/Board Type:MCU, FPGA
  • Core Processor:ARM Cortex-A9
  • Co-Processor:Zynq-7000 (Z-7020)
  • Speed:-
  • Flash Size:32MB
  • RAM Size:512MB
  • Connector Type:B2B
  • Size / Dimension:2.050" L x 2.990" W (52.00mm x 76.00mm)
  • Operating Temperature:-40°C ~ 85°C

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TE0729-02-62I63MA

Overview

The Trenz Electronic TE0729-02-62I63MA is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC (XC7Z020). It features a dual-core ARM Cortex-A9 MPCore and 136 FPGA I/Os. The module includes 512 MByte DDR3 SDRAM, 32 MByte QSPI Flash, and 4 GByte eMMC Flash. Connectivity comprises one Gigabit Ethernet PHY and two 10/100 Mbps Ethernet PHYs, alongside Hi-speed USB 2.0 OTG support. Power rails include 4.0 A at 1.0 V, 1.5 A at 1.5 V, 1.5 A at 1.8 V, and 1.5 A at 2.5 V.

Feature Summary

  • Industrial-grade Xilinx Zynq-7000 (XC7Z020) SoC with dual-core ARM Cortex-A9
  • Memory configuration: 512 MByte DDR3 SDRAM, 32 MByte QSPI Flash, 4 GByte eMMC
  • Three Ethernet interfaces: one Gigabit (Marvell 88E1512) and two 10/100 Mbps (Microchip KSZ8081)
  • Hi-speed USB 2.0 ULPI transceiver with full OTG support

Applications

  • Industrial automation systems requiring rugged environmental performance
  • Embedded computing platforms utilizing Zynq programmable logic
  • Network infrastructure nodes requiring multiple Ethernet MAC addresses
  • Portable devices needing USB OTG connectivity and real-time clock functionality

Procurement Notes

Verify the specific ordering suffix 'MA' against the manufacturer's current documentation to confirm component revisions or packaging variations. Confirm that the industrial temperature range (-40°C to +85°C) aligns with the target application environment requirements before integration.

Selection Notes

Select this module for applications demanding high signal integrity through evenly spread supply pins and robust power delivery via integrated DC-DC converters. Ensure the baseboard design accommodates the 5 mm stacking height and utilizes compatible REF-189019-01 mating connectors for reliable board-to-board interfacing.

Part Context

This module belongs to the TE0729 family of System on Modules manufactured by Trenz Electronic. It is designed as a plug-on solution featuring two 120-pin double-row connectors. The hardware revision is indicated on the PCB, and the module supports boot modes from JTAG, SPI Flash, SD Card, and secondary boot from eMMC.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing baseboards using Samtec BSE-060-01-L-D-A compatible connectors.

TE0729-02-62I63MATE0729-02-62I63MA

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