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The Trenz Electronic TE0729-02-62I63MA is an industrial-grade System on Module (SoM) based on the Xilinx Zynq-7000 SoC (XC7Z020). It features a dual-core ARM Cortex-A9 MPCore and 136 FPGA I/Os. The module includes 512 MByte DDR3 SDRAM, 32 MByte QSPI Flash, and 4 GByte eMMC Flash. Connectivity comprises one Gigabit Ethernet PHY and two 10/100 Mbps Ethernet PHYs, alongside Hi-speed USB 2.0 OTG support. Power rails include 4.0 A at 1.0 V, 1.5 A at 1.5 V, 1.5 A at 1.8 V, and 1.5 A at 2.5 V.
Verify the specific ordering suffix 'MA' against the manufacturer's current documentation to confirm component revisions or packaging variations. Confirm that the industrial temperature range (-40°C to +85°C) aligns with the target application environment requirements before integration.
Select this module for applications demanding high signal integrity through evenly spread supply pins and robust power delivery via integrated DC-DC converters. Ensure the baseboard design accommodates the 5 mm stacking height and utilizes compatible REF-189019-01 mating connectors for reliable board-to-board interfacing.
This module belongs to the TE0729 family of System on Modules manufactured by Trenz Electronic. It is designed as a plug-on solution featuring two 120-pin double-row connectors. The hardware revision is indicated on the PCB, and the module supports boot modes from JTAG, SPI Flash, SD Card, and secondary boot from eMMC.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing baseboards using Samtec BSE-060-01-L-D-A compatible connectors.