TE0729-03-62I63MAK

Overview

The TE0729-03-62I63MAK is a System-on-Module (SOM) manufactured by Trenz Electronic, built around the AMD Xilinx Zynq-7020 SoC. This specific variant features an industrial temperature range (-40°C to +85°C) and includes 512 MByte of DDR3L memory with three Ethernet interfaces. The module integrates QSPI flash for boot storage and supports standard debugging protocols including JTAG. It utilizes a compact form factor designed for integration into custom carrier boards, providing a complete computing solution with integrated processing logic and programmable logic sections.

Feature Summary

• Based on AMD Xilinx Zynq-7020 SoC with dual ARM Cortex-A9 processors
• Includes 512 MByte DDR3L SDRAM for system memory
• Features three independent Ethernet MAC/PHY interfaces
• Industrial operating temperature range from -40°C to +85°C

Applications

• Industrial automation controllers requiring multiple network connections
• Embedded vision systems utilizing the programmable logic fabric
• Data acquisition modules with strict environmental tolerance requirements
• Custom carrier board designs for space-constrained embedded applications

Procurement Notes

Verify component availability status as this model may be subject to discontinuation or limited supply. Confirm that the required quantity matches current distributor stock levels. Ensure compatibility with existing carrier board designs regarding pinout and power requirements before procurement. Check for any Product Change Notifications (PCN) that might affect long-term supply chain stability.

Selection Notes

Select this module when three Ethernet ports are required alongside the Zynq-7020 processing power. Compare against variants with higher memory capacities if application demands exceed 512 MB. Verify that the industrial temperature rating meets the deployment environment specifications. Consider the physical footprint constraints relative to other TE0729 series modules.

Part Context

This module belongs to the TE0729 family of Trenz Electronic SOMs, which are standardized around the Xilinx Zynq-7000 architecture. The '03' suffix typically denotes the third generation or revision of this specific form factor. It serves as a building block for developers needing to integrate FPGA capabilities with ARM processing without designing base silicon.

Replacement Considerations

Check for updated revisions within the TE0729 series such as TE0729-03-62I63MA. Evaluate alternative Trenz modules like TE0720 or TE0724 if different I/O configurations or memory sizes are acceptable. Cross-reference with newer Xilinx Zynq UltraScale+ MPSoC modules if performance upgrades are necessary.