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The TE0741-02-070-2IF is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for embedded computing applications. It integrates the Xilinx Kintex-7 XC7K70T-2FBG676I FPGA as its primary processing element. The module adheres to a standard 40 mm x 50 mm footprint, facilitating compact integration into carrier boards. It operates within an industrial temperature range of -40°C to +85°C and requires a 3.3 V supply voltage. Key interfaces supported include I2C, JTAG, QSPI, and SPI, enabling versatile connectivity for configuration and peripheral communication.
This component is listed with an End-of-Life (EOL) status by the manufacturer. Availability is restricted, and distributors may indicate non-sale or limited stock conditions. Verification of current lifecycle status and alternative sourcing options is required before procurement planning.
Select this module when a Kintex-7 FPGA is required in a small 4x5 cm footprint. Ensure the design supports the specific FBG676 package and utilizes the documented interface set. Verify thermal management capabilities for the specified industrial temperature range.
The TE0741 series comprises modular system-on-modules from Trenz Electronic based on Xilinx FPGAs. This specific part number corresponds to the Kintex-7 variant, distinct from other series members like the Zynq SoC or Artix-7 modules. It serves as a building block for custom carrier board designs.
Due to the EOL status, direct replacement parts are not publicly confirmed. Engineers should evaluate newer Xilinx FPGA families or updated SOM generations from Trenz Electronic that maintain compatible footprints or pin-outs.