TE0741-03-070-2IF

Overview

The TE0741-03-070-2IF is a System-on-Module (SOM) manufactured by Trenz Electronic, featuring the Xilinx Kintex-7 XC7K70T-2FBG676I FPGA. It adheres to a standard 40 mm x 50 mm footprint and operates within a commercial temperature range of -40°C to +85°C. The module requires a 3.3 V supply voltage and integrates 32 MB of flash memory. It does not include installed RAM. Connectivity interfaces include I2C, JTAG, QSPI, and SPI. The unit weighs approximately 110 g.

Feature Summary

• Integrates Xilinx Kintex-7 XC7K70T-2FBG676I FPGA
• Standard 40 mm x 50 mm form factor
• Operational temperature range from -40°C to +85°C
• Includes 32 MB flash memory with no installed RAM

Applications

• Industrial computing systems requiring FPGA logic
• Embedded control applications utilizing standard SOM footprints
• Prototyping platforms for Xilinx Kintex-7 architectures

Procurement Notes

This component is listed as End-of-Life (EOL) by the manufacturer. Availability is restricted, and Mouser indicates non-supply in certain regions. Verification of current stock status and alternative sourcing channels is required before procurement planning.

Selection Notes

Select this module when a compact 4x5 cm FPGA solution with Kintex-7 capabilities is needed. Ensure the design supports 3.3 V power rails and utilizes available interfaces like SPI or QSPI for configuration. Note that external memory must be provided if RAM is required for the application.

Part Context

Part of the TE0741 series from Trenz Electronic, designed for modular embedded solutions. It serves as a building block for custom carrier boards, leveraging the standard footprint common across the family for mechanical compatibility.

Replacement Considerations

As an EOL product, direct replacements are unavailable. Consider newer Trenz Electronic SOMs with updated FPGA families or generic Kintex-7 modules from other vendors, ensuring pinout and footprint compatibility.