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The TE0741-03-160-2IF is a System-on-Module (SOM) manufactured by Trenz Electronic, designed for high-performance embedded applications. It integrates the Xilinx Kintex-7 XC7K160T-2FBG676I FPGA as its central processing unit. The module adheres to a standard 40 mm x 50 mm footprint, facilitating integration into carrier boards within the TE0741 series ecosystem. It operates on a 3.3 V supply voltage and supports industrial temperature ranges from -40°C to +85°C. Key interfaces include I2C, JTAG, QSPI, and SPI. The component features 32 MB of flash memory. This specific model is identified as obsolete in public distributor records.
Public distributor data indicates this part number is obsolete or discontinued. Verification of current availability through official Trenz Electronic channels or authorized legacy stockholders is required before procurement planning. No active manufacturing status is confirmed in open sources.
Select this module when a Kintex-7 device with 160T logic capacity is required in a compact 4x5 cm form factor. Ensure compatibility with TE0741 series carrier boards. Verify that the FBG676 package fits the target design constraints. Consider the obsolete status for long-term production viability.
This module belongs to the Trenz Electronic TE0741 family of System-on-Modules based on Xilinx 7 Series FPGAs. It shares the physical footprint with other variants like the TE0741-03-070-2IF but utilizes the higher-capacity XC7K160T chip. The series is designed for modular evaluation and deployment in space-constrained embedded environments.
No direct public substitute part numbers are listed for this obsolete model. Engineers may consider newer Xilinx Artix-7 or Zynq UltraScale+ MPSoC modules from Trenz Electronic if pin-compatibility allows, though these require carrier board redesign.