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Product Detailed Parameters
- Description：MODULE FPGA KINTEX
- Series：-
- Mfr：Trenz Electronic GmbH
- Package：Box
- Module/Board Type：FPGA Core
- Core Processor：Xilinx Kintex-7 FPGA XC7K70T-2FBG676I
- Co-Processor：-
- Speed：-
- Flash Size：32MB
- RAM Size：-
- Connector Type：Board-to-Board (BTB) Socket
- Size / Dimension：1.970" L x 1.570" W (50.00mm x 40.00mm)
- Operating Temperature：-40°C ~ 85°C
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Overview
The TE0741-04-A2I-1-A is a System-on-Module (SOM) manufactured by Trenz Electronic GmbH, designed for programmable logic applications. It integrates an AMD Kintex 7 70T-2IF FPGA as its core processing component. The module includes 32 MByte of QSPI Flash memory for configuration and storage. Physically, the module measures 4 x 5 cm, providing a compact form factor suitable for embedded designs. It is classified under FPGA development tools and modules.
Feature Summary
- Integrates AMD Kintex 7 70T-2IF FPGA for high-performance programmable logic
- Includes 32 MByte QSPI Flash for non-volatile data storage
- Compact 4 x 5 cm System-on-Module form factor
Applications
- Embedded programmable logic systems
- FPGA-based hardware prototyping
- Industrial control modules
Procurement Notes
Verify the specific suffix codes against official Trenz Electronic documentation to confirm pinout compatibility and peripheral configurations. Ensure that the required AMD Kintex 7 70T-2IF device grade matches the application environment. Cross-reference the datasheet for any recent Product Change Notifications regarding memory or interface updates before finalizing procurement orders.
Selection Notes
Select this module when a compact SOM solution with the AMD Kintex 7 70T architecture is required. Consider the 32 MByte QSPI Flash capacity for boot image storage needs. Evaluate the 4 x 5 cm footprint against available board space in the target design. Confirm that the integrated FPGA meets the specific logic resource and I/O requirements of the project.
Part Context
This part belongs to the Trenz Electronic TE07xx series of System-on-Modules. These modules are designed to simplify the integration of complex FPGAs into custom carrier boards. The series provides standardized interfaces and pre-integrated memory components, reducing development time for engineers implementing Xilinx/AMD FPGA technology in commercial or industrial products.
Replacement Considerations
Consult Trenz Electronic for direct module replacements within the TE07xx series. Verify if other Kintex 7 variants offer compatible mechanical and electrical interfaces. No public substitute part numbers are confirmed in the provided source material.
