TE0741-05-B2C-1-AF

Overview

The Trenz Electronic TE0741-05-B2C-1-AF is a System-on-Module (SOM) designed for high-performance programmable logic applications. It integrates an AMD Xilinx Kintex™ 7 XC7K325T FPGA, providing substantial logic capacity and digital signal processing capabilities. The module includes 8 Multi-Gigabit Transceivers (MGTs) for high-speed serial communication interfaces. Memory resources consist of 32 MByte Flash for non-volatile storage and DDR3L memory for system operations. Designed for industrial environments, it supports operating temperatures up to +70°C and features a compact form factor measuring 50 mm x 40 mm.

Feature Summary

• Integrates AMD Xilinx Kintex 7 FPGA with advanced logic and DSP resources
• Includes 8 Multi-Gigabit Transceivers for high-speed data transmission
• Provides integrated 32 MByte Flash memory for code and data storage
• Supports industrial temperature range up to +70°C

Applications

• Industrial automation and control systems
• High-speed data acquisition and processing
• Telecommunications infrastructure equipment
• Medical imaging devices requiring real-time processing

Procurement Notes

Verify the specific suffix 'AF' against official Trenz Electronic documentation to confirm component revisions and availability status. Ensure compatibility with baseboards supporting the XMOD or similar form factors. Check for updated supply chain notifications regarding lead times and production cycles. Confirm that the selected variant meets the required thermal and environmental specifications for the target application environment.

Selection Notes

Select this module when high-throughput serial connectivity and robust FPGA logic are required in a compact footprint. The Kintex 7 architecture offers a balance of performance and power efficiency suitable for complex embedded tasks. Consider the integrated memory configuration for standalone operation needs. Evaluate the industrial temperature rating against the operational environment constraints before finalizing the design integration.

Part Context

This module belongs to the Trenz Electronic SOM family, which provides pre-integrated FPGA solutions to accelerate development cycles. These modules typically interface with custom carrier boards via high-density connectors. The product line emphasizes reliability and compliance with industrial standards, offering a standardized hardware platform for various embedded computing applications across different sectors.

Replacement Considerations

Consult official Trenz Electronic documentation for verified substitute part numbers within the same product family. Cross-reference pinout and electrical characteristics if considering alternative FPGA vendors. Ensure any replacement maintains compatibility with existing mechanical mounting and connector interfaces.